公开(公告)号：US09618716B2

公开(公告)日：2017-04-11

申请号：US14988739

申请日：2016-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Cheon Park ,  Cha-Jea Jo ,  Tae-Je Cho

IPC: G02B6/43 ,  G02B6/44 ,  G02B6/122 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/1226 ,  G02B6/428 ,  G02B6/4283 ,  G02B6/4295 ,  G02B6/4416 ,  Y02E10/52

Abstract: A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.