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公开(公告)号:US20140103193A1
公开(公告)日:2014-04-17
申请号:US14052168
申请日:2013-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: GwideokRyan Lee , SangChul Sul , Myungwon Lee , Min-ho Kim , Taechan Kim , Taeseok Oh , KwangHyun Lee , Taeyon Lee , Younggu Jin
IPC: H01L27/146
CPC classification number: H01L27/14609 , B82Y20/00 , H01L27/1461 , H01L27/14612 , H01L27/14679
Abstract: A binary image sensor includes a plurality of unit pixels on a substrate having a surface on which light is incident. At least one quantum dot is disposed on the surface of a substrate. A column sense amplifier circuit is configured to detect binary information of a selected unit pixel among the plurality of unit pixels from a voltage or a current detected from the selected unit pixel, and a processing unit is configured to process binary information of the respective unit pixels to generate pixel image information. Related devices and methods of operation are also discussed.
Abstract translation: 二值图像传感器包括在具有光入射的表面的基板上的多个单位像素。 至少一个量子点设置在基板的表面上。 列读出放大器电路被配置为从从所选择的单位像素检测的电压或电流中检测多个单位像素中的所选单位像素的二进制信息,并且处理单元被配置为处理各单位像素的二进制信息 以生成像素图像信息。 还讨论了相关设备和操作方法。
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公开(公告)号:US09679929B2
公开(公告)日:2017-06-13
申请号:US14052168
申请日:2013-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: GwideokRyan Lee , SangChul Sul , Myungwon Lee , Min-ho Kim , Taechan Kim , Taeseok Oh , KwangHyun Lee , Taeyon Lee , Younggu Jin
IPC: H01L27/146 , B82Y20/00
CPC classification number: H01L27/14609 , B82Y20/00 , H01L27/1461 , H01L27/14612 , H01L27/14679
Abstract: A binary image sensor includes a plurality of unit pixels on a substrate having a surface on which light is incident. At least one quantum dot is disposed on the surface of a substrate. A column sense amplifier circuit is configured to detect binary information of a selected unit pixel among the plurality of unit pixels from a voltage or a current detected from the selected unit pixel, and a processing unit is configured to process binary information of the respective unit pixels to generate pixel image information. Related devices and methods of operation are also discussed.
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