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公开(公告)号:US12133015B2
公开(公告)日:2024-10-29
申请号:US17542574
申请日:2021-12-06
申请人: LG DISPLAY CO., LTD.
发明人: Shihyung Park , Moonsoo Kang , Jaeho Yoon , Donghyeon Jang
IPC分类号: H04N5/32 , H01L27/146
CPC分类号: H04N5/32 , H01L27/1461 , H01L27/14614 , H01L27/14658
摘要: A digital X-ray detector includes a width of a data line or a gate line extending across a dummy pixel area is smaller than a width of the data line or the gate line extending across an active area, a width of a dummy gate line or a dummy data line extending across the dummy pixel area is smaller than a width of the gate line or the data line extending across the active area, so that static electricity generated during a manufacturing process does not randomly flow into the active area, but rather flows into the dummy pixel area having the lowest capacitance, and the static electricity may be guided not to the active area but to the dummy gate line or dummy data line in the dummy pixel area, thereby minimizing line defects or block luminance deviation defects caused by the static electricity generated during the manufacturing process.
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公开(公告)号:US12117538B2
公开(公告)日:2024-10-15
申请号:US17274519
申请日:2019-09-09
发明人: Ryoto Yoshita , Takafumi Takatsuka
IPC分类号: G01S19/30 , G01S19/37 , H01L27/146
CPC分类号: G01S19/30 , G01S19/37 , H01L27/1461 , H01L27/14614 , H01L27/1464 , H01L27/14643
摘要: A solid-state imaging device according to an embodiment of the present disclosure includes a light receiving surface, and two or more pixels opposed to the light receiving surface. Each of the pixels includes a photoelectric conversion section that performs photoelectric conversion on light entering via the light receiving surface, a first charge holding section that holds a charge transferred from the photoelectric conversion section, and a second charge holding section disposed at a position where all or a portion thereof overlaps the first charge holding section in a planar layout, and formed to have no electrical continuity to the first charge holding section. Each of the pixels further includes a first transfer transistor that transfers the charge held by the first charge holding section to a floating diffusion, and a second transfer transistor that transfers a charge held by the second charge holding section to the floating diffusion.
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公开(公告)号:US12114516B2
公开(公告)日:2024-10-08
申请号:US17648543
申请日:2022-01-20
发明人: Yukio Kaneda
IPC分类号: H10K30/30 , H01L27/146 , H10K30/82 , H10K39/32
CPC分类号: H10K30/353 , H01L27/146 , H01L27/1461 , H01L27/14643 , H01L27/14645 , H01L27/14667 , H10K30/82 , H10K39/32 , H01L27/14665 , Y02E10/549 , Y02P70/50
摘要: The present technology relates to, in a photoelectric conversion element using a photoelectric conversion film, the photoelectric conversion element and a method of manufacturing the same, a solid state image sensor, an electronic device, and a solar cell, for enabling improvement of quantum efficiency. The photoelectric conversion element includes two electrodes constituting an anode and a cathode, and a photoelectric conversion layer arranged between the two electrodes, and at least one electrode side of the two electrodes is doped with an impurity at impurity density of 1e16/cm3 or more in the photoelectric conversion layer. The present technology can be applied to, for example, a solid state image sensor, an electronic device, a solar cell and the like.
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公开(公告)号:US12113078B2
公开(公告)日:2024-10-08
申请号:US17479835
申请日:2021-09-20
发明人: Akito Inoue , Yuki Sugiura , Yutaka Hirose
IPC分类号: H01L27/146 , H04N25/75
CPC分类号: H01L27/1461 , H01L27/14603 , H01L27/14643 , H04N25/75
摘要: A photodetector includes: a semiconductor substrate having a first main surface and a second main surface; a first semiconductor layer that is of a first conductivity type, and is included in the semiconductor substrate and closer to the first main surface than to the second main surface; a second semiconductor layer that is of a second conductivity type different from the first conductivity type, and is included in the semiconductor substrate and interposed between the first semiconductor layer and the second main surface; a multiplication region that causes avalanche multiplication to a charge generated in the semiconductor substrate through photoelectric conversion; a circuit region disposed alongside the first semiconductor layer in a direction parallel to the first main surface; at least one isolation transistor disposed in the circuit region; and an isolation region interposed between the first semiconductor layer and the circuit region.
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公开(公告)号:US12094896B2
公开(公告)日:2024-09-17
申请号:US17984261
申请日:2022-11-10
发明人: Zhaoyao Zhan , Qianwei Ding , Xiaohong Jiang , Ching Hwa Tey
IPC分类号: H01L27/146
CPC分类号: H01L27/1461 , H01L27/14623
摘要: A photosensitive device is disclosed, including an integrated circuit structure, a first pad and a second pad exposed from a surface of the integrated circuit structure, a first material layer disposed on the surface of the integrated circuit structure and covering the first pad, and a second material layer disposed on the first material layer and covering the second pad. The first material layer and the second material layer form a heterojunction photodiode.
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公开(公告)号:US12094895B2
公开(公告)日:2024-09-17
申请号:US17838911
申请日:2022-06-13
发明人: Junji Hirase , Yoshihiro Sato , Yasuyuki Endoh , Hiroyuki Amikawa
IPC分类号: H01L27/146 , H01L27/02 , H04N25/57 , H04N25/75 , H04N25/76
CPC分类号: H01L27/1461 , H01L27/0288 , H01L27/14603 , H01L27/14636 , H01L27/14643 , H04N25/57 , H04N25/75 , H04N25/76
摘要: An imaging device having a semiconductor substrate including: a semiconductor region including an impurity of a first conductivity type, a first diffusion region that is in contact with the semiconductor region, that includes an impurity of a second conductivity type different from the first conductivity type, and that converts incident light into charges, and a second diffusion region that includes an impurity of the second conductivity type and that directly accumulates at least a part of the charges generated in the first diffusion region. The imaging device further includes a contact plug in contact with the second diffusion region, and a capacitive element electrically connected to the second diffusion region through the contact plug.
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公开(公告)号:US12087789B2
公开(公告)日:2024-09-10
申请号:US18342423
申请日:2023-06-27
发明人: Kosaku Saeki
IPC分类号: H01L27/146 , H04N25/76 , H04N25/75
CPC分类号: H01L27/14612 , H01L27/1461 , H01L27/14636 , H01L27/14643 , H01L27/14665 , H04N25/76 , H04N25/75
摘要: An imaging apparatus including a semiconductor substrate which includes a charge accumulation portion containing an impurity of a first conductivity type; a contact plug which is connected to the charge accumulation portion, contains an impurity of the first conductivity type, and is not silicide; a first insulating film which includes an upper wall located above the contact plug; and a second insulating film which includes a portion located above the upper wall. A material of the second insulating film is different from a material of the first insulating film.
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公开(公告)号:US12080733B2
公开(公告)日:2024-09-03
申请号:US17026864
申请日:2020-09-21
发明人: Yuki Sugiura , Akito Inoue
IPC分类号: H01L27/146 , H01L31/107
CPC分类号: H01L27/1461 , H01L27/14603 , H01L27/14643 , H01L31/107
摘要: A solid-state imaging device includes: a p-type semiconductor substrate; an n-type first semiconductor layer located above the semiconductor substrate and forming a junction with the semiconductor substrate in the first area; and an n-type second semiconductor layer located between the semiconductor substrate and the first semiconductor layer in the second area outward of the first area and having an impurity concentration lower than an impurity concentration of the first semiconductor layer. The semiconductor substrate and the first semiconductor layer form APD1, and the second semiconductor layer extends to a level below an interface between the semiconductor substrate and the first semiconductor layer in a thickness direction of the semiconductor substrate.
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公开(公告)号:US12057461B2
公开(公告)日:2024-08-06
申请号:US18225298
申请日:2023-07-24
发明人: Francois Guyader , Sara Pellegrini , Bruce Rae
IPC分类号: H01L27/146 , G01J1/44 , H01L31/107 , H04N25/70
CPC分类号: H01L27/1461 , G01J1/44 , H01L27/14634 , H01L31/107 , H04N25/70 , G01J2001/4466
摘要: An electronic device includes a stack of a first level having a SPAD, a second level having a quench circuit for said SPAD, and a third level having a circuit for processing data generated by said SPAD. A method for making the device includes: a) forming of the first level; b) bonding, on the first level, by molecular bonding, of a stack of layers including a semiconductor layer; and c) forming the quench circuit of the second level in the semiconductor layer.
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公开(公告)号:US12051705B2
公开(公告)日:2024-07-30
申请号:US17471049
申请日:2021-09-09
发明人: Raul Andres Bianchi , Marios Barlas , Alexandre Lopez , Bastien Mamdy , Bruce Rae , Isobel Nicholson
IPC分类号: H01L27/146 , G02B5/18
CPC分类号: H01L27/14605 , H01L27/1462 , G02B5/18 , G02B5/1814 , G02B5/1819 , G02B5/1828 , G02B5/1842 , H01L27/14607 , H01L27/1461 , H01L27/1463 , H01L27/1464
摘要: The present disclosure relates to a pixel comprising: a photodiode comprising a portion of a substrate of a semiconductor material, extending vertically from a first face of the substrate to a second face of the substrate configured to receive light; a layer of a first material covering each of the lateral surfaces of the portion; a layer of a second material covering the portion on the side of the first face, first and second material having refractive indexes lower than that of the semiconductor material; and a diffractive structure disposed on a face of the photodiode on the side of the second face.
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