ELECTRONIC DEVICE AND METHOD FOR DISPLAYING OBJECT FOR PROVIDING SPLIT SCREEN

    公开(公告)号:US20200333932A1

    公开(公告)日:2020-10-22

    申请号:US16851442

    申请日:2020-04-17

    Abstract: An electronic device is provided. The electronic device includes a first housing including a first surface and a second surface faced away from the first surface, a second housing including a third surface and a fourth surface faced away from the third surface, a first display including a folding part rotatably connecting a side surface of the first housing and a side surface of the second housing facing the side surface of the first housing, the first display being disposed on the first surface and the third surface across the folding part, a second display disposed on the second surface of the first housing, at least one memory storing instructions, and at least one processor.

    ELECTRONIC DEVICE, METHOD, AND COMPUTER-READABLE MEDIUM FOR PROVIDING SPLIT SCREEN

    公开(公告)号:US20220035494A1

    公开(公告)日:2022-02-03

    申请号:US17451305

    申请日:2021-10-18

    Abstract: An electronic device according to various embodiments comprises at least one memory for storing instructions and a foldable display, and is operably coupled with the foldable display and the at least one memory, wherein the electronic device, when executing instructions, may display a first screen in a first region of the foldable display, including a first sub-region and a second sub-region adjacent to the first sub-region while the foldable display is in an unfolded state, receive a first drag input from an edge region in the first region away from an edge in the first region that corresponds to the edge region while displaying the first screen in the first region, and in response to receiving the first drag input, display a list partially superimposed on the first screen, and including at least one executable object for indicating some of applications that have been executed in the second sub-region.

    SEMICONDUCTOR CHIP PACKAGE TEST SOCKETS
    3.
    发明申请
    SEMICONDUCTOR CHIP PACKAGE TEST SOCKETS 有权
    半导体芯片封装测试插座

    公开(公告)号:US20130260592A1

    公开(公告)日:2013-10-03

    申请号:US13829081

    申请日:2013-03-14

    CPC classification number: H01R23/70 G01R1/0466 G01R1/0483

    Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

    Abstract translation: 半导体芯片封装测试插座可以包括插座壳体; 插座壳体中的多个探针; 探针上的导电垫; 浮动引导件,其构造成覆盖所述导电焊盘的边缘并且被配置为在所述导电焊盘上提供半导体芯片封装; 和/或固定在插座壳体上的夹具。 夹具可以将浮动导向件与插座壳体组合。

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