-
公开(公告)号：US20250071891A1
公开(公告)日：2025-02-27
申请号：US18944174
申请日：2024-11-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Sungwon PARK , Eunseck HONG
Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
-
公开(公告)号：US20200053195A1
公开(公告)日：2020-02-13
申请号：US16533012
申请日：2019-08-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon PARK , Jinki JUNG
Abstract: An electronic device is provided. The electronic device includes a first communication circuit that communicates with short-range communication devices, a second communication circuit that receives an incoming call, a display, and a processor that is operatively connected with the first communication circuit, the second communication circuit, and the display and controls the display. When receiving the incoming call via the second communication circuit, the processor determines whether there is a short-range communication device connected via the first communication circuit and displays at least one of a first call reception object associated with the incoming call or a second call reception object associated with one of the short-range communication devices on the display, depending on whether at least one short-range communication device is connected to the electronic device.
-
公开(公告)号：US20230040596A1
公开(公告)日：2023-02-09
申请号：US17879303
申请日：2022-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon PARK , Sunyoung KIM , Younghun SEONG , Yongjin SHIN
Abstract: An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member may include a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate.
-
公开(公告)号：US20220151073A1
公开(公告)日：2022-05-12
申请号：US17545374
申请日：2021-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun LEE , Sungwon PARK , Sunghyup LEE , Byeonguk MIN
Abstract: A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.
-
公开(公告)号：US20210329784A1
公开(公告)日：2021-10-21
申请号：US17267651
申请日：2019-08-09
Applicant: Samsung Electronics Co., Ltd. , SI FLEX CO., LTD.
Inventor： Sungwon PARK , Junghyub KIM , Hwanyoul JEONG , Seungyup LEE , Youngsun LEE , Hesuk JUNG , Eunseok HONG
Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.
-
Patent Agency Ranking
公开(公告)号：US20230119129A1
公开(公告)日：2023-04-20
申请号：US17967532
申请日：2022-10-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun LEE , Sungwon PARK , Eunseok HONG
Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
-
公开(公告)号：US20210314439A1
公开(公告)日：2021-10-07
申请号：US17266894
申请日：2019-08-06
Applicant: SAMSUNG ELECTRONICS CO., ltd.
Inventor： Jinki JUNG , Sungwon PARK , Jaein YOO , Yongkoo LEE
Abstract: An electronic device according to various embodiments may comprise a communication module, a display, an output device, and a processor, wherein the processor is configured to: in response to the reception of a call signal through the communication module, identify a caller corresponding to the call signal; identify a first photo on the basis of the caller; when the electronic device has been configured to output sound in response to the reception of the call signal, output an incoming call screen generated on the basis of the first photo to at least part of the display, wherein the incoming call screen includes one or more image components, each having at least one display attribute that changes according to a change of the sound characteristics of a ringtone; and output the ringtone through the output device while outputting the incoming call screen. Various other embodiments are also possible.
-
公开(公告)号：US20210185809A1
公开(公告)日：2021-06-17
申请号：US17118757
申请日：2020-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon PARK
Abstract: Various embodiments relate to an apparatus. The apparatus may include: a first printed circuit board including a first ground layer having one or more openings formed therein and a wiring layer on which a signal wire is disposed; a second printed circuit board including a second ground layer having one or more openings formed therein; a first area and a third area in which the first printed circuit board and the second printed circuit board are connected to each other via an insulating layer; and a second area, which extends from the first area to the third area, and in which the first printed circuit board and the second printed circuit board are spaced apart from each other, with an air layer interposed therebetween. Various other embodiments may be possible.
-
公开(公告)号：US20210036434A1
公开(公告)日：2021-02-04
申请号：US16941643
申请日：2020-07-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghwan YEOM , Youngjong KIM , Sungwon PARK , Handug LEE , Jongwoo CHOI
Abstract: Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.
-
公开(公告)号：US20200006853A1
公开(公告)日：2020-01-02
申请号：US16460937
申请日：2019-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon PARK , Dongil SON , Sangwon HA
Abstract: An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.018 seconds)
