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公开(公告)号:US20210375896A1
公开(公告)日:2021-12-02
申请号:US17099994
申请日:2020-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoung-Hee KIM , Woo Choel NOH , Ik Soo KIM , Jun Kwan KIM , Jinsub KIM , Yongjin SHIN
IPC: H01L27/11539 , H01L27/11519 , H01L27/11551 , H01L27/11565 , H01L27/11573 , H01L27/11578
Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.
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公开(公告)号:US20230180472A1
公开(公告)日:2023-06-08
申请号:US18097592
申请日:2023-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoung-Hee KIM , Woo Choel NOH , Ik Soo KIM , Jun Kwan KIM , Jinsub KIM , Yongjin SHIN
Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.
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公开(公告)号:US20230040596A1
公开(公告)日:2023-02-09
申请号:US17879303
申请日:2022-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungwon PARK , Sunyoung KIM , Younghun SEONG , Yongjin SHIN
Abstract: An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member may include a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate.
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公开(公告)号:US20170164089A1
公开(公告)日:2017-06-08
申请号:US15347168
申请日:2016-11-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seung-Ho LEE , Yong-Yi KIM , Chungsoon PARK , Yongjin SHIN
IPC: H04R1/10
CPC classification number: H04R1/1025 , H04R1/1016 , H04R5/04 , H04R2420/07
Abstract: An electronic device is provided. The electronic device includes a wireless communication circuit; a processor connected to the communication circuit; and a memory connected to the processor, wherein the processor is configured to establish a connection to a first and second earpiece by the wireless communication circuit; receive, from the first earpiece, a first data related to a charging level of a first battery included in the first earpiece by the communication circuit; receive, from the first earpiece or the second earpiece, a second data that is related to a charging level of a second battery in the second earpiece by the communication circuit; and transmit, to at least one of the first earpiece or the second earpiece, one or more control signals that enable the first earpiece and the second earpiece to operate differently from each other based on the first and second data.
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