公开(公告)号：US20230119129A1

公开(公告)日：2023-04-20

申请号：US17967532

申请日：2022-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE ,  Sungwon PARK ,  Eunseok HONG

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

公开(公告)号：US20250071891A1

公开(公告)日：2025-02-27

申请号：US18944174

申请日：2024-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE ,  Sungwon PARK ,  Eunseck HONG

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

公开(公告)号：US20250060787A1

公开(公告)日：2025-02-20

申请号：US18937655

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungho LEE ,  Youngsun LEE ,  Jiwon KIM ,  Kwanghee RYU ,  Jungchul AN ,  Chulhyo YOON ,  Seungki CHOI

IPC: G06F1/16 ,  G06F3/0354 ,  G06F3/041 ,  H04M1/02

Abstract: An electronic device may include: a first housing; a second housing; a hinge structure; a display; and a sensor panel, wherein the sensor panel comprises: a support layer which comprises a polymer inclusive material and is in contact with an adhesive material arranged on at least one of a first surface of the first housing and a third surface of the second housing; a shielding layer arranged on the support layer; a first insulating layer arranged on the shielding layer; a first conductive pattern arranged on the first insulating layer; a second insulating layer arranged on the first conductive pattern; a second conductive pattern arranged on the second insulating layer; and a third insulating layer arranged on the second conductive pattern and facing one surface of the display, wherein the thickness of at least one of the first insulating layer and the third insulating layer is greater than the thickness of the second insulating layer.

公开(公告)号：US20210251071A1

公开(公告)日：2021-08-12

申请号：US17171461

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE ,  Byeongkeol KIM ,  Yeongjin LEE ,  Jongmin JEON ,  Jaeyoub JUNG ,  Eunseok HONG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.

公开(公告)号：US20230354511A1

公开(公告)日：2023-11-02

申请号：US18348622

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun LEE ,  Kideok KIM ,  Byeongkeol KIM ,  Jongbum LEE ,  Jongmin JEON ,  Jeongbeom CHO

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K1/0281 ,  H05K1/147 ,  H05K3/28 ,  H05K2201/10378

Abstract: An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.

公开(公告)号：US20230077324A1

公开(公告)日：2023-03-16

申请号：US17988925

申请日：2022-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon CHOI ,  Taehun KIM ,  Youngsun LEE ,  Jaeyoung HUH

IPC: H04R3/02 ,  H04M1/03 ,  H04M1/60 ,  H04M1/02 ,  G10L15/22 ,  H04R1/04 ,  H04R1/40 ,  H04R1/28 ,  H04R3/00 ,  H04R1/02 ,  G10L21/0232

Abstract: According to certain embodiments, an electronic device comprises: first housing; a first substrate disposed in the first housing; a second housing; a second substrate disposed in the second housing; a flexible printed circuit board (FPCB) connecting the first substrate and the second substrate; a hinge hingably connecting the first housing and the second housing; a hinge cover covering the hinge, the hinge cover having a microphone hole formed therein; at least one first microphone disposed in the first housing; a speaker disposed in the second housing; and at least one second microphone disposed in the hinge, and configured to collect external sound through the microphone hole formed in the hinge cover, and mounted on a portion extending from the FPCB.

公开(公告)号：US20230040036A1

公开(公告)日：2023-02-09

申请号：US17903405

申请日：2022-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE

IPC: H05K5/02 ,  F16C11/04 ,  H04M1/02

Abstract: According to various example embodiments, a foldable electronic device configured to move a flexible printed circuit board along a support plate during an unfolding operation may include: a hinge configured to support a flexible printed circuit board, wherein the hinge may include: a hinge body, a support plate rotatably connected to the hinge body, a slider slidable along the support plate and configured to support the flexible printed circuit board, and a connecting part configured to connect the support plate and a connecting plate.

公开(公告)号：US20220322522A1

公开(公告)日：2022-10-06

申请号：US17298810

申请日：2021-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE ,  Eunseok HONG ,  Byeongkeol KIM ,  Jongmin JEON

IPC: H05K1/02 ,  H05K1/03

Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

公开(公告)号：US20250081360A1

公开(公告)日：2025-03-06

申请号：US18825526

申请日：2024-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun LEE

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11

Abstract: An electronic device may include a housing, a circuit board disposed in the housing, a camera assembly spaced apart from the circuit board, and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include a base layer, a first conductive layer coupled to the base layer, a first shielding layer including a 1-1th shielding layer portion located in the first rigid portion, a 1-2th shielding layer portion located in the second rigid portion and a 1-3th shielding layer portion located in the flexible portion, and spaced apart from the first conductive portion, and a first ground layer, wherein at least a portion of the first ground layer extends along a circumference of the first rigid portion, and the first ground layer is connected to the first shielding layer. Other various embodiments are also available.

公开(公告)号：US20230363082A1

公开(公告)日：2023-11-09

申请号：US18348003

申请日：2023-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeongkeol KIM ,  Eunseok HONG ,  Youngsun LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/42 ,  H04M1/02 ,  H04B1/00

CPC classification number: H05K1/0219 ,  H05K1/028 ,  H05K1/118 ,  H05K3/28 ,  H05K3/429 ,  H04M1/0277 ,  H04B1/0053 ,  H05K2201/09636

Abstract: An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.