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公开(公告)号:US20160255182A1
公开(公告)日:2016-09-01
申请号:US15054844
申请日:2016-02-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-Young LEE , Tae-Hwan KANG , Jung-Ho CHUN
IPC: H04M1/02
CPC classification number: H04M1/026
Abstract: According to various embodiments of the present disclosure, an electronic device may include: an external housing having a through-hole that connects the inside and the outside of the portable electronic device; a first structure that is accommodated in a space of the external housing and has an opening and a passage, wherein the opening is disposed adjacent to the through-hole and the passage extends in a first direction and is connected to the opening; a second structure that is accommodated in the space of the external housing and disposed adjacent to the first structure, and has a portion directed toward the through-hole; and a material that is located on the portion of the second structure so as to be visible from the outside through the through-hole and changes color in reaction to contact of a fluid. In addition, various other embodiments can be made.
Abstract translation: 根据本公开的各种实施例,电子设备可以包括:具有连接便携式电子设备的内部和外部的通孔的外部壳体; 第一结构,其容纳在所述外部壳体的空间中并且具有开口和通道,其中所述开口邻近所述通孔设置,并且所述通道沿第一方向延伸并连接到所述开口; 第二结构,其容纳在所述外部壳体的所述空间中并且邻近所述第一结构设置,并且具有朝向所述通孔的部分; 以及位于第二结构部分上的材料,以便通过通孔从外部可见,并且改变与液体的接触反应的颜色。 此外,可以进行各种其它实施例。
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公开(公告)号:US20170083121A1
公开(公告)日:2017-03-23
申请号:US15269452
申请日:2016-09-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae-Hwan KANG , Jongyoon LIM
IPC: G06F3/0354
CPC classification number: G06F3/03545
Abstract: Disclosed is an electronic device that enables the waterproofing of an input pen that is removably mounted on the electronic device.
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公开(公告)号:US20190132973A1
公开(公告)日:2019-05-02
申请号:US16232686
申请日:2018-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号:US20170188475A1
公开(公告)日:2017-06-29
申请号:US15457246
申请日:2017-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号:US20160044801A1
公开(公告)日:2016-02-11
申请号:US14796514
申请日:2015-07-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung-Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
Abstract translation: 提供电子设备。 电子设备包括支撑构件,该支撑构件包括由导电材料形成的至少一部分,外壳构件构造成接收支撑构件,并且至少包括一部分由导电材料形成。 外壳构件的导电材料部分和支撑构件的导电材料部分彼此绝缘。
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