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    BOARD ASSEMBLY
    1.
    发明申请
    BOARD ASSEMBLY 有权
    董事会大会

    公开(公告)号：US20140307410A1

    公开(公告)日：2014-10-16

    申请号：US14104266

    申请日：2013-12-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Su JUNG ,  Sang-Hyeon KIM ,  Young-Tae KIM ,  Hong-Beom KIM ,  Il-Sung JEONG

    IPC: H05K1/02

    CPC classification number: H05K1/0216 ,  H04M1/0277 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10371

    Abstract: A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.

    Abstract translation: 板组件包括：电路板; 耦合到所述电路板以面对所述电路板的屏蔽构件; 以及至少一个用于安装在电路板上的存储介质的插座。 屏蔽构件包括将整个插座暴露于外部的开口。 板组件形成双凹槽结构中的开口以容纳插座。 因此，板组件可以有助于在与电池堆叠的同时减小电子设备的厚度。 此外，整个插座暴露于屏蔽构件的外部，可以容易地移除存储介质。

    INJECTION-MOLDED PRODUCT AND MOLD FOR FABRICATING THE SAME
    2.
    发明申请
    INJECTION-MOLDED PRODUCT AND MOLD FOR FABRICATING THE SAME 审中-公开
    注射成型产品和模具用于制造它们

    公开(公告)号：US20140017434A1

    公开(公告)日：2014-01-16

    申请号：US13853576

    申请日：2013-03-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sang-Hyeon KIM ,  Su-Kyu LEE

    IPC: B32B3/26

    CPC classification number: B32B3/266 ,  B29C45/14065 ,  B29C45/14377 ,  B29C45/14631 ,  B29C45/14639 ,  B29C2045/0093 ,  B29C2045/14934 ,  B29K2705/00 ,  B29L2031/3437 ,  B29L2031/3456 ,  B29L2031/3481 ,  G06F1/1698 ,  H01Q1/243 ,  H04M1/0249 ,  Y02A30/50 ,  Y10T428/23

    Abstract: An injection-molded product includes a reinforcement member formed with a through-hole, a heat-resistant member attached to an outer surface of the reinforcement member to close an opening of the through-hole, and an injection-molded member comprising a synthetic resin that encloses the outer surface of the reinforcement member. The injection-molded product allows the thickness of a portable electronic device to be reduced by about 0.4 mm as compared to injection-molded product of the related art when it is used as a case of the portable electronic device while securing a structural strength and impact resistance in the same level as those of the conventional injection-molded product. Because the infiltration of a molten resin into the through-hole of the reinforcement member is prevented by arranging the heat-resistant member to close the through-hole, it is possible to prevent a poor molding, such as contraction on the outer appearance of the injection-molded product.

    Abstract translation: 注塑产品包括形成有通孔的加强件，安装在加强件的外表面以封闭通孔的开口的耐热件，以及包含合成树脂的注射成型件 其包围加强构件的外表面。 与现有技术的注射成型产品相比，注射成型产品的厚度可以减小约0.4mm，当将其用作便携式电子设备的情况同时确保结构强度和冲击时 电阻与常规注塑产品的电阻相同。 由于通过设置耐热构件来封闭通孔来防止熔融树脂渗透到加强构件的通孔中，因此可以防止诸如外部的外观的收缩等不良成型 注塑产品。

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