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公开(公告)号：US20190132973A1
公开(公告)日：2019-05-02
申请号：US16232686
申请日：2018-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号：US20170188475A1
公开(公告)日：2017-06-29
申请号：US15457246
申请日：2017-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号：US20160044801A1
公开(公告)日：2016-02-11
申请号：US14796514
申请日：2015-07-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong-Seok LEE , Tae-Hwan KANG , Hyun-Jun KWON , Ki-Deuk KIM , Sang-Hyeon KIM , Jin-A MOCK , Sung-Young LEE , Min-Su JUNG , Hong-Moon CHUN , Jung-Woong HYUN
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
Abstract translation: 提供电子设备。 电子设备包括支撑构件，该支撑构件包括由导电材料形成的至少一部分，外壳构件构造成接收支撑构件，并且至少包括一部分由导电材料形成。 外壳构件的导电材料部分和支撑构件的导电材料部分彼此绝缘。
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