公开(公告)号：US11450632B2

公开(公告)日：2022-09-20

申请号：US17101443

申请日：2020-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeho Kang

IPC: H01L23/00

Abstract: A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.

公开(公告)号：US11735542B2

公开(公告)日：2023-08-22

申请号：US17946326

申请日：2022-09-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeho Kang

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L24/20 ,  H01L2224/05025 ,  H01L2224/13021

Abstract: A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.

公开(公告)号：US09460609B2

公开(公告)日：2016-10-04

申请号：US14631161

申请日：2015-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongsuk Lee ,  Taeho Kang ,  Sungwoo Choi

IPC: G08B1/08 ,  G08B21/24 ,  G08B13/14 ,  G08B21/02

CPC classification number: G08B21/24 ,  G08B13/1436 ,  G08B21/028

Abstract: A method and an apparatus for preventing the loss of an electronic device are provided. The method includes establishing a communication link between a first electronic device and a second electronic device through activation of wireless communication at the first electronic device, collecting, upon detection of movement of the first electronic device, sensing information of the first electronic device, receiving sensing information from the second electronic device through the communication link, comparing the sensing information of the first electronic device with the sensing information of the second electronic device, and checking whether a loss incident has occurred on the basis of the comparison result.

Abstract translation: 提供一种用于防止电子设备丢失的方法和装置。 该方法包括通过在第一电子设备处的无线通信的激活来建立第一电子设备和第二电子设备之间的通信链路，在检测到第一电子设备的移动时收集第一电子设备的感测信息，接收感测 来自第二电子设备的通过通信链路的信息，将第一电子设备的感测信息与第二电子设备的感测信息进行比较，并且基于比较结果来检查是否发生了丢失事件。

公开(公告)号：US20210335736A1

公开(公告)日：2021-10-28

申请号：US17101443

申请日：2020-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeho Kang

IPC: H01L23/00

Abstract: A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.