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公开(公告)号:US20240074155A1
公开(公告)日:2024-02-29
申请号:US18236143
申请日:2023-08-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taehyuk Kim , Taegyu Kang , Seokho Shin , Kiseok Lee , Sangho Lee , Keunnam Kim , Seokhan Park , Joongchan Shin , Moonyoung Jeong , Eunju Cho
IPC: H10B12/00
CPC classification number: H10B12/482 , H10B12/315 , H10B12/488
Abstract: A semiconductor device includes a substrate, a bit line extending on the substrate in a first direction, first and second active patterns on the bit line, a back-gate electrode between the first and second active patterns and extending across the bit line and in a second direction that is perpendicular to the first direction, a first word line extending in the second direction at one side of the first active pattern, a second word line extending in the second direction at the other side of the second active pattern, and a contact pattern connected to each of the first and second active patterns, wherein the contact pattern sequentially includes an epitaxial growth layer, a doped polysilicon layer, and a silicide layer.
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公开(公告)号:US20190068846A1
公开(公告)日:2019-02-28
申请号:US16053128
申请日:2018-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwajoong Jung , Manho Kim , Taehyuk Kim , Taeyun Kim , Yonghwan Choi , Kihuk Lee
Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.
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公开(公告)号:US20250151260A1
公开(公告)日:2025-05-08
申请号:US18739698
申请日:2024-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehyuk Kim , Taejin Park , Hyeran Lee , Sungsoo Yim
Abstract: A semiconductor device includes bit line structures spaced apart from each other in a first direction, and each of the bit line structures extends in a second direction; channels on the bit line structures, wherein the channels are electrically connected to the bit line structures and spaced apart from each other in the first direction; a gate insulation pattern structure on sidewalls of each of the channels; a gate electrode structure including: a first gate electrode on a first sidewall of the gate insulation pattern structure; and a second gate electrode on a second sidewall of the gate insulation pattern structure, wherein the second sidewall faces the first sidewall in the second direction, wherein the second gate electrode is on a third sidewall in the first direction of an end portion of the gate insulation pattern structure, and wherein the second gate electrode contacts the first gate electrode.
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公开(公告)号:US11032459B2
公开(公告)日:2021-06-08
申请号:US16053128
申请日:2018-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwajoong Jung , Manho Kim , Taehyuk Kim , Taeyun Kim , Yonghwan Choi , Kihuk Lee
Abstract: An apparatus and method for a camera module is provided. The camera module includes a substrate, a first image sensor disposed in a first area on one side of the substrate, a second image sensor disposed in a second area on the one side, a reinforcement member disposed in an area around the first area and the second area so as to support at least a portion of the substrate, a first housing disposed in an area including at least a portion of the first area so as to be stacked on the first image sensor and one part of the reinforcement member while accommodating a first lens part corresponding to the first image sensor, and a second housing disposed in an area including at least a portion of the second area so as to be stacked on the second image sensor and the other part of the reinforcement member.
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