公开(公告)号：US20210043612A1

公开(公告)日：2021-02-11

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： JANGWOO LEE ,  JONGBO SHIM ,  JI HWANG KIM ,  YUNGCHEOL KONG ,  YOUNGBAE KIM ,  TAEHWAN KIM ,  HYUNGLAK MA

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.