公开(公告)号：US20200020637A1

公开(公告)日：2020-01-16

申请号：US16432551

申请日：2019-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HWANG KIM ,  KILSOO KIM ,  JONGBO SHIM ,  JANGWOO LEE ,  EUNHEE JUNG

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a substrate, a semiconductor chip mounted on the substrate, an interposer chip on the semiconductor chip and including a redistribution pattern, a first pad on the interposer chip, a second pad on the interposer chip and spaced apart from the first pad, and a bonding wire electrically connected to the second pad and the first substrate. The second pad is electrically connected through the redistribution pattern to the first pad. The footprint of the interposer chip is greater than the footprint of the first semiconductor chip.

公开(公告)号：US20210043612A1

公开(公告)日：2021-02-11

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： JANGWOO LEE ,  JONGBO SHIM ,  JI HWANG KIM ,  YUNGCHEOL KONG ,  YOUNGBAE KIM ,  TAEHWAN KIM ,  HYUNGLAK MA

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.

公开(公告)号：US20150294730A1

公开(公告)日：2015-10-15

申请号：US14600353

申请日：2015-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JANGWOO LEE ,  KYOUNGTAE KANG ,  TAESUNG LEE ,  JEONGDON IHM

IPC: G11C16/32

CPC classification number: G11C16/26 ,  G11C16/30 ,  G11C16/32

Abstract: A strobe signal shaping method for a data storage system includes receiving a strobe signal; boosting a first clock edge portion of the strobe signal when the strobe signal is received after having been idle or paused over a predetermined time period; and returning to an operating mode in which boosting is turned off with respect to a second clock edge portion of the strobe signal.

Abstract translation: 数据存储系统的选通信号整形方法包括接收选通信号; 当在预定时间段内空闲或暂停之后接收到选通信号时，提升选通信号的第一时钟边缘部分; 并且返回到相对于选通信号的第二时钟边缘部分关闭升压的操作模式。

公开(公告)号：US20210349660A1

公开(公告)日：2021-11-11

申请号：US17030635

申请日：2020-09-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TONGSUNG KIM ,  JANGWOO LEE ,  SEONKYOO LEE ,  CHIWEON YOON ,  JEONGDON IHM

IPC: G06F3/06 ,  G06K9/62

Abstract: A storage device includes NVM package and a controller connected to the NVM package through a channel and controlling operation of the NVM package. The NVM package includes an interface chip, first NVM devices connected to the interface chip through a first internal channel and second NVM devices connected to the interface chip through a second internal channel. The interface chip selects the first internal channel in response to an operation request received from the controller and connects the first internal channel to the channel. The interface chip also determines whether retraining is necessary in relation to the second internal channel and transmits a retraining request to the controller when retraining is necessary.

公开(公告)号：US20170098578A1

公开(公告)日：2017-04-06

申请号：US15158890

申请日：2016-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JANGWOO LEE ,  YOUNGDOO JUNG

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/02

CPC classification number: H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/03 ,  H01L24/11 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method of fabricating a semiconductor package is disclosed. The method includes forming a plurality of semiconductor chips and a mold layer covering the semiconductor chips on a substrate, forming outer terminals on a bottom surface of the substrate, coating a water-soluble material on the bottom surface of the substrate and the outer terminals to form a coating layer, cutting the substrate and the mold layer to separate the semiconductor chips from each other, and forming a shielding layer on the cutted mold layer.

公开(公告)号：US20170186491A1

公开(公告)日：2017-06-29

申请号：US15461241

申请日：2017-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JANGWOO LEE ,  KYOUNGTAE KANG ,  TAESUNG LEE ,  JEONGDON IHM

IPC: G11C16/26 ,  G11C16/32

CPC classification number: G11C16/26 ,  G11C16/30 ,  G11C16/32

Abstract: A strobe signal shaping method for a data storage system includes receiving a strobe signal; boosting a first clock edge portion of the strobe signal when the strobe signal is received after having been idle or paused over a predetermined time period; and returning to an operating mode in which boosting is turned off with respect to a second clock edge portion of the strobe signal.

公开(公告)号：US20160204782A1

公开(公告)日：2016-07-14

申请号：US14960748

申请日：2015-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： JANGWOO LEE ,  HyunJin Kim ,  Daehoon Na ,  Jeongdon Ihm

IPC: H03K19/0175 ,  G11C7/10

CPC classification number: H03K19/017545 ,  G11C7/04 ,  G11C7/1069 ,  G11C7/1096 ,  G11C16/0483 ,  G11C29/022 ,  G11C29/028 ,  G11C2207/105 ,  G11C2207/108

Abstract: An integrated circuit includes an input/output pad, a driver circuit connected to the input/output pad, and a receiver circuit connected to the input/output pad, and a code generator. The driver circuit is configured to output an output signal to an external device through the input/output pad. The receiver circuit is configured to receive an input signal from the external device through the input/output pad. The code generator is configured to generate a termination code of the external device in response to a signal output from the receiver circuit.

Abstract translation: 集成电路包括输入/​​输出焊盘，连接到输入/输出焊盘的驱动器电路以及连接到输入/输出焊盘的接收器电路和代码发生器。 驱动电路被配置为通过输入/输出板将输出信号输出到外部设备。 接收器电路被配置为通过输入/输出接收器从外部设备接收输入信号。 代码生成器被配置为响应于从接收器电路输出的信号来产生外部设备的终止代码。