公开(公告)号：US20240072177A1

公开(公告)日：2024-02-29

申请号：US18345130

申请日：2023-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Kim ,  Yeondo Jung ,  Gwirim Park ,  Yelin Lee ,  Kichul Kim ,  Kyungin Choi

IPC: H01L29/786 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

CPC classification number: H01L29/78696 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/6656 ,  H01L29/775 ,  H01L29/4908

Abstract: A semiconductor device includes channels spaced apart from each other on a substrate in a vertical direction substantially perpendicular to an upper surface of the substrate, a gate structure on the substrate and bordering lower and upper surfaces and a first sidewall of at least a portion of each of the channels, and a source/drain layer on a portion of the substrate adjacent to the gate structure and contacting second sidewalls of the channels. A nitrogen-containing portion is formed at an upper portion of an uppermost one of the channels, and may be doped with nitrogen.