公开(公告)号：US12171065B2

公开(公告)日：2024-12-17

申请号：US18456153

申请日：2023-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Ha ,  Subyung Kang ,  Sanghoon Park ,  Soohyun Seo ,  Yongjin Woo ,  Yeomoon Yoon

IPC: H05K1/14 ,  H01L23/40

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

公开(公告)号：US11744017B2

公开(公告)日：2023-08-29

申请号：US16868941

申请日：2020-05-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Ha ,  Subyung Kang ,  Sanghoon Park ,  Soohyun Seo ,  Yongjin Woo ,  Yeomoon Yoon

IPC: H05K1/14 ,  H01L23/40

CPC classification number: H05K1/145 ,  H05K1/144 ,  H01L2023/4087 ,  H05K1/111 ,  H05K1/117

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.