公开(公告)号：US20240355758A1

公开(公告)日：2024-10-24

申请号：US18756926

申请日：2024-06-27

申请人： Intel Corporation

发明人： Steven Adam Klein ,  Jason Gamba ,  Matthew Thomas Guzy ,  Nicholas Steven Haehn ,  Tarek Adly Ibrahim ,  Brandon Christian Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Jacob John Schichtel

IPC分类号： H01L23/544 ,  H01L23/15 ,  H01L23/40

CPC分类号： H01L23/544 ,  H01L23/15 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/54426

摘要： Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.

公开(公告)号：US12125804B2

公开(公告)日：2024-10-22

申请号：US18362989

申请日：2023-08-01

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Kang Hsieh ,  Hao-Yi Tsai ,  Tin-Hao Kuo ,  Shih-Wei Chen

IPC分类号： H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/40 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2221/68372 ,  H01L2224/95001 ,  H01L2924/3511

摘要： A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

公开(公告)号：US12114466B2

公开(公告)日：2024-10-08

申请号：US17132477

申请日：2020-12-23

申请人： Intel Corporation

发明人： Penchala Pratap Binni Boyina ,  Kathiravan D ,  Babu Triplicane Gopikrishnan ,  Prakash Kurma Raju ,  Deepak Sekar ,  Hari Shanker Thakur

IPC分类号： H05K7/20 ,  F28D15/04 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427

CPC分类号： H05K7/20336 ,  F28D15/04 ,  G06F1/203 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4087

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

公开(公告)号：US12096601B2

公开(公告)日：2024-09-17

申请号：US17742596

申请日：2022-05-12

申请人： Ciena Corporation

发明人： Maxwell Thomas McKerlie

IPC分类号： H05K7/20 ,  H01L23/40

CPC分类号： H05K7/2049 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2023/4087

摘要： A backing plate assembly with jack screw for bare die device heat sink applications to ensure uniform loading. The jack screw is used to force a PCB support plate and mounting plate apart, and by doing so, compresses a plurality of springs and applies uniform pressure to the heat sink, which in turn applies pressure to the bare die of the BGA device. The single jack screw is essential to the design, as it creates a single point to apply torque and compress all the springs at the same time. A lock screw is meant to maintain the position of the PCB support plate and the mounting plate. Prior to assembly, the lock screw keeps the PCB support plate and mounting plate together to ease installation.

公开(公告)号：US12062591B2

公开(公告)日：2024-08-13

申请号：US17159257

申请日：2021-01-27

申请人： Hitachi Energy Ltd

发明人： Milad Maleki ,  Harald Beyer ,  Dominik Truessel

IPC分类号： H01L23/40 ,  H01L23/31

CPC分类号： H01L23/4006 ,  H01L23/3171 ,  H01L2023/4081 ,  H01L2023/4087

摘要： A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region.

公开(公告)号：US20240266300A1

公开(公告)日：2024-08-08

申请号：US18107257

申请日：2023-02-08

申请人： Infineon Technologies AG

发明人： Marco Bäßler ,  Michael Niendorf

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H05K1/18

CPC分类号： H01L23/562 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/49861 ,  H05K1/18 ,  H01L23/3121 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48175 ,  H05K2201/09063 ,  H05K2201/09409 ,  H05K2201/1059

摘要： A power semiconductor module includes: an electrically insulative enclosure; a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure; a lead frame or clip frame disposed above the power semiconductor dies inside the electrically insulative enclosure and electrically connected to the power semiconductor dies; a plurality of contact pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure; and a plurality of vibration dampeners attached to the lead frame or clip frame. The vibration dampeners protrude through the first side of the electrically insulative enclosure and are separate from the electrical connection interface. The vibration dampeners are configured to dampen vibrations at a circuit board designed to be mounted to the module and do not affect electrical operation of the power semiconductor module.

公开(公告)号：US20240266250A1

公开(公告)日：2024-08-08

申请号：US18564532

申请日：2022-04-20

申请人： HITACHI ENERGY SWITZERLAND AG

发明人： Lluis SANTOLARIA ,  Dominik TRUESSEL ,  Harald BEYER

IPC分类号： H01L23/40 ,  H01L21/48

CPC分类号： H01L23/4006 ,  H01L21/4871 ,  H01L2023/4087

摘要： A clamping element (9) is specified configured to be pressed to a baseplate (2) of at least one power semiconductor module (1) comprising a mold (4), comprising—at least one contact area (10) being configured to be in direct contact to at least one clamping area (7) of the baseplate (2) being free of the mold (4), and—at least one recess (11) provided in the baseplate, wherein—the recess (11) and the contact area (10) are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.

公开(公告)号：US20240258198A1

公开(公告)日：2024-08-01

申请号：US18479834

申请日：2023-10-03

申请人： Acer Incorporated

发明人： Yu-Shih Wang ,  Chih-Chun Liu ,  Cheng-Nan Ling ,  Wen-Chieh Tai

IPC分类号： H01L23/40

CPC分类号： H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4087

摘要： The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.

公开(公告)号：US12027444B2

公开(公告)日：2024-07-02

申请号：US17305951

申请日：2021-07-19

申请人： LENOVO (SINGAPORE) PTE. LTD.

发明人： Seiji Yamasaki ,  Masaaki Bandoh ,  Shigeru Yuzawa ,  Hua Wang

IPC分类号： H01L23/40 ,  G06F1/20 ,  H05K1/18

CPC分类号： H01L23/4006 ,  G06F1/203 ,  H05K1/181 ,  H01L2023/4087 ,  H05K2201/10409 ,  H05K2201/10598

摘要： An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.

公开(公告)号：US11982500B2

公开(公告)日：2024-05-14

申请号：US17656194

申请日：2022-03-23

申请人： DELTA ELECTRONICS, INC.

发明人： Chao-Wen Lu

IPC分类号： F28F13/06 ,  H01L23/40

CPC分类号： F28F13/06 ,  H01L23/4006 ,  F28F2215/00 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087

摘要： A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion is a flat plate with two main surfaces parallel with each other and a plurality of side surfaces. One of the two main surfaces is a contacting surface contacting a heat source. The heat dissipation portion is extended outward from at least one of the plurality of side surfaces of the heat conduction portion. The heat dissipation portion includes a plurality of first branches and a plurality of second branches. Each of the first branches is a flat plate and has two opposite main surfaces and four side surfaces. The two opposite main surfaces of each of the first branches are parallel to the two main surfaces of the heat conduction portion. The second branches are extended from the first branches and parallel to the heat conduction portion.