公开(公告)号：US11378662B2

公开(公告)日：2022-07-05

申请号：US16150724

申请日：2018-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-jae Shin ,  Kyoung-ho Ha ,  Seong-gu Kim ,  Yong-hwack Shin ,  Chang-gyun Shin ,  Dong-sik Shim ,  Chang-bum Lee ,  Jung-ho Cha

IPC: G01S7/481 ,  G01S7/486 ,  G01S17/42 ,  G01S17/88 ,  G01S7/484

Abstract: The bi-directional optical integrated circuit device array includes a plurality of bi-directional optical integrated circuit unit devices integrated on a substrate and arranged in two-dimensions. Each of the bi-directional optical integrated circuit unit devices includes a single wavelength laser light source integrated on the substrate, a bi-directional optical device integrated on the substrate and optically connected to the laser light source, and an antenna integrated on the substrate and optically connected to the bi-directional optical device.

公开(公告)号：US20140376859A1

公开(公告)日：2014-12-25

申请号：US14483583

申请日：2014-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-Sung Joe ,  Sung-dong Suh ,  Kyoung-won Na ,  Kyoung-ho Ha ,  Seong-gu Kim ,  Yong-hwack Shin

IPC: G02B6/124 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/124 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/122

Abstract: An integrated circuit device includes a plurality of device layers disposed on a substrate. A first one of the device layers includes at least one photo device and/or at least one electronic device and a second one of the device layers includes at least one photo device overlying the at least one photo device and/or the at least one electronic device of the first one of the device layers.

Abstract translation: 集成电路器件包括设置在衬底上的多个器件层。 设备层中的第一个包括至少一个照片设备和/或至少一个电子设备，并且设备层中的第二个设备层包括覆盖至少一个照片设备和/或至少一个电子设备的至少一个照片设备 第一个设备层的设备。