公开(公告)号：US09475092B2

公开(公告)日：2016-10-25

申请号：US14287556

申请日：2014-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Seog-woo Hong ,  Seok-whan Chung ,  Chang-jung Kim

IPC: H04R25/00 ,  B06B1/02 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81C1/00182 ,  Y10T29/49005

Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.

Abstract translation: 电声换能器包括：导电基板，其中形成有第一沟槽，并且包括由第一沟槽包围的电极连接单元; 设置在所述导电基板上的膜; 设置在所述膜上以与所述电极连接单元的上表面接触的上电极; 设置在所述导电基板的下表面上以接触所述电极连接单元的下表面的第一电极; 以及与所述第一电极间隔开并设置成与所述导电基板的下表面接触的第二电极。

公开(公告)号：US09319800B2

公开(公告)日：2016-04-19

申请号：US14317135

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seog-woo Hong ,  Hyung-jae Shin ,  Dong-sik Shim ,  Byung-gil Jeong ,  Seok-whan Chung

IPC: H04R23/00 ,  B06B1/02 ,  B06B1/06 ,  G10K11/00

CPC classification number: H04R23/00 ,  B06B1/0292 ,  B06B1/0685 ,  G10K11/002 ,  H04R2201/003

Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.

Abstract translation: 一种电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与该导电衬底相对设置并且设置有至少一个对应于该电极的焊盘的焊盘衬底，其中至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。

公开(公告)号：US11378662B2

公开(公告)日：2022-07-05

申请号：US16150724

申请日：2018-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-jae Shin ,  Kyoung-ho Ha ,  Seong-gu Kim ,  Yong-hwack Shin ,  Chang-gyun Shin ,  Dong-sik Shim ,  Chang-bum Lee ,  Jung-ho Cha

IPC: G01S7/481 ,  G01S7/486 ,  G01S17/42 ,  G01S17/88 ,  G01S7/484

Abstract: The bi-directional optical integrated circuit device array includes a plurality of bi-directional optical integrated circuit unit devices integrated on a substrate and arranged in two-dimensions. Each of the bi-directional optical integrated circuit unit devices includes a single wavelength laser light source integrated on the substrate, a bi-directional optical device integrated on the substrate and optically connected to the laser light source, and an antenna integrated on the substrate and optically connected to the bi-directional optical device.

公开(公告)号：US09664894B2

公开(公告)日：2017-05-30

申请号：US14078716

申请日：2013-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Woon-bae Kim ,  Hyung Choi

IPC: G02B26/02 ,  B81B7/00

CPC classification number: G02B26/023 ,  B81B7/0016 ,  B81B2201/045 ,  B81B2203/0163

Abstract: A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode.

公开(公告)号：US09110318B2

公开(公告)日：2015-08-18

申请号：US14079138

申请日：2013-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Woon-bae Kim ,  Hyung Choi

IPC: H01L33/08 ,  G02F1/13 ,  G02B26/02 ,  H01L27/12 ,  G02F1/1362 ,  G02F1/1368 ,  H01L21/77

CPC classification number: G02F1/13 ,  G02B26/02 ,  G02F1/136213 ,  G02F1/1368 ,  H01L27/1214 ,  H01L27/1259 ,  H01L2021/775

Abstract: A driving device of a display apparatus, and a method of manufacturing the driving device. The driving device may have a specific structure, and be manufactured in such a manner, because a first electrode of a micro optical switch device may be formed simultaneously with the formation of at least a source region and a drain region, or a gate electrode of an active device and a capacitor electrode.

Abstract translation: 显示装置的驱动装置，以及制造该驱动装置的方法。 驱动装置可以具有特定结构，并且以这种方式制造，因为微型光开关装置的第一电极可以同时形成至少形成源极区域和漏极区域或栅极电极 有源器件和电容器电极。

公开(公告)号：US10093534B2

公开(公告)日：2018-10-09

申请号：US15922972

申请日：2018-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Seog-woo Hong ,  Seok-whan Chung ,  Chang-jung Kim

IPC: B81B7/00 ,  B06B1/02 ,  B81C1/00

Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

公开(公告)号：US09957155B2

公开(公告)日：2018-05-01

申请号：US14286460

申请日：2014-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Seog-woo Hong ,  Seok-whan Chung ,  Chang-jung Kim

IPC: B81B7/00 ,  B81C1/00 ,  B06B1/02

CPC classification number: B81B7/007 ,  B06B1/0292 ,  B81C1/00301

Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

公开(公告)号：US09596528B2

公开(公告)日：2017-03-14

申请号：US14280725

申请日：2014-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim ,  Seog-woo Hong ,  Seok-whan Chung ,  Chang-jung Kim

IPC: H04R1/00 ,  H01L21/768 ,  H01L21/304 ,  H01L23/48 ,  H01L21/02 ,  B06B1/02

CPC classification number: H04R1/00 ,  B06B1/0292 ,  H01L21/0237 ,  H01L21/3043 ,  H01L21/768 ,  H01L23/481 ,  H01L2924/0002 ,  H04R19/005 ,  H01L2924/00

Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.

Abstract translation: 一种电容微加工超声波换能器包括：器件基板，包括限定对应于多个元件的多个第一部分的第一沟槽和限制与多个第一部分分离的第二部分的第二沟槽;设置在器件基板上的支撑单元， 限制与所述多个元件中的每一个相对应的多个空腔;设置在所述支撑单元上以覆盖所述多个空腔的膜;设置在所述膜上并通过通孔电连接到所述第二沟槽中的所述第二部分的上电极 穿过膜和支撑单元，以及设置在器件衬底的下表面上的穿硅通孔（TSV）衬底，并且包括连接到多个第一部分的多个第一通孔金属和连接到多个第一通孔的第二通孔金属 到第二部分。

公开(公告)号：US09164276B2

公开(公告)日：2015-10-20

申请号：US13912719

申请日：2013-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik Shim

IPC: G02B26/02

CPC classification number: G02B26/02

Abstract: A micro optical switching device is provided, including a substrate, a first electrode disposed on a first surface of the substrate and including a first opening array including having a first plurality of openings, a second electrode disposed over the first electrode and including a second opening array including a plurality of second openings which do not overlap with the plurality of first openings, and a support member disposed on the substrate. The support member has a thickness greater than a distance from the first surface of the substrate to the second electrode and protrudes above the second electrode.

Abstract translation: 提供一种微光学开关装置，包括基板，设置在基板的第一表面上的第一电极，并且包括具有第一多个开口的第一开口阵列，设置在第一电极上的第二电极，并且包括第二开口 阵列，其包括不与所述多个第一开口重叠的多个第二开口，以及设置在所述基板上的支撑构件。 支撑构件的厚度大于从衬底的第一表面到第二电极的距离，并且在第二电极上方突出。