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    Semiconductor package and semiconductor device including the same
    1.
    发明授权
    Semiconductor package and semiconductor device including the same 有权
    半导体封装和包括其的半导体器件

    公开(公告)号：US08929693B2

    公开(公告)日：2015-01-06

    申请号：US13787918

    申请日：2013-03-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dong-jae Shin ,  Hyun-il Byun ,  Kwang-hyun Lee ,  Kwan-sik Cho ,  Ho-chul Ji ,  Jung-hyung Pyo ,  Kyoung-ho Ha

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/43

    CPC classification number: G02B6/12 ,  G02B6/4207 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311

    Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection.

    Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底。

    Optical transmitters including photonic integrated circuit
    5.
    发明授权
    Optical transmitters including photonic integrated circuit 有权

    公开(公告)号：US10230473B2

    公开(公告)日：2019-03-12

    申请号：US15427392

    申请日：2017-02-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dong-jae Shin ,  Kyoung-ho Ha ,  Seong-gu Kim ,  Jin-kwon Bok ,  Jung-ho Cha ,  Dong-hyun Kim

    IPC: H04B10/50 ,  G02B6/42 ,  H04B10/572 ,  H04B10/80 ,  H04J14/02 ,  H04B10/032 ,  G02B6/43

    Abstract: An optical transmitter includes photonic integrated circuits configured to respectively output optical transmission signals in different wavelength ranges. A photonic integrated circuit may include emitters configured to emit beams having different wavelengths; drivers configured to respectively provide power to the emitters, and a wavelength division multiplexer configured to transmit the beams emitted by the emitters. A photonic integrated circuit may include a switch device that controls the drivers, and light detectors configured to detect intensities of the beams emitted from the emitters. The switch device may selectively operate at least one driver of the plurality of drivers based on information associated with intensities of the beams. The switch device may selectively operate a driver connected to an emitter, based on a determination that an intensity of a beam emitted by another emitter is less than a threshold intensity value.

    OPTICAL PHASED ARRAY (OPA)
    7.
    发明申请
    OPTICAL PHASED ARRAY (OPA) 审中-公开

    公开(公告)号：US20180052378A1

    公开(公告)日：2018-02-22

    申请号：US15462147

    申请日：2017-03-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dong-jae SHIN ,  Hyun-il Byun ,  Kyoung-ho Ha ,  Seong-gu Kim ,  Jin-kwon Bok ,  Jung-ho Cha ,  Dong-hyun Kim ,  Yong-sang Park ,  Min-kyung Kim

    IPC: G02F1/29 ,  G01S7/481 ,  G01S17/93 ,  G01S17/89

    Abstract: An optical phased array (OPA) may be included in a light detection and ranging (LiDAR) system and may be configured to perform beam steering. The OPA may include a cascading structure of splitters configured to enable a branch operation to be performed M times. Each splitter may split an input optical signal in a ratio of 1:1 and output the split input optical signal. The OPA may include a plurality of sets of first phase shifters (PSs), each set of first PSs located exclusively on one output end of a separate splitter, each set of first PSs including a particular quantity of first PSs based on a branch position at which the separate splitter is located. The OPA may be included in a LiDAR system that is further included in a vehicle that is configured to enable navigation of the vehicle, including autonomous navigation, through an environment.

    Semiconductor Package and Semiconductor Device Including the Same
    8.
    发明申请
    Semiconductor Package and Semiconductor Device Including the Same 有权
    半导体封装和包括其的半导体器件

    公开(公告)号：US20130330035A1

    公开(公告)日：2013-12-12

    申请号：US13787918

    申请日：2013-03-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dong-Jae Shin ,  Hyun-il Byun ,  Kwang-hyun Lee ,  Kwan-sik Cho ,  Ho-chul Ji ,  Jung-hyung Pyo ,  Kyoung-ho Ha

    IPC: G02B6/12

    CPC classification number: G02B6/12 ,  G02B6/4207 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311

    Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection

    Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底

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