公开(公告)号：US20200336817A1

公开(公告)日：2020-10-22

申请号：US16921406

申请日：2020-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Ho Lee ,  Yong-Yi Kim ,  Chungsoon Park ,  Yongjin Shin

IPC: H04R1/10

Abstract: An electronic device is provided. The electronic device includes a wireless communication circuit; a processor electrically connected to the wireless communication circuit; and a memory electrically connected to the processor, wherein the processor is configured to establish a connection to a first earpiece and a second earpiece by using the wireless communication circuit; receive, from the first earpiece, first data that is related to a charging level of a first battery included in the first earpiece by using the wireless communication circuit; receive, from the first earpiece or the second earpiece, second data that is related to a charging level of a second battery included in the second earpiece by using the wireless communication circuit; and transmit, to at least one of the first earpiece or the second earpiece, one or more control signals that enable the first earpiece and the second earpiece to be configured to operate differently from each other based on at least some of the first data and the second data.

公开(公告)号：US12016178B2

公开(公告)日：2024-06-18

申请号：US18097592

申请日：2023-01-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung-Hee Kim ,  Woo Choel Noh ,  Ik Soo Kim ,  Jun Kwan Kim ,  Jinsub Kim ,  Yongjin Shin

IPC: H10B41/46 ,  H10B41/10 ,  H10B41/20 ,  H10B43/10 ,  H10B43/20 ,  H10B43/40

CPC classification number: H10B41/46 ,  H10B41/10 ,  H10B41/20 ,  H10B43/10 ,  H10B43/20 ,  H10B43/40

Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.

公开(公告)号：US11563017B2

公开(公告)日：2023-01-24

申请号：US17099994

申请日：2020-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung-Hee Kim ,  Woo Choel Noh ,  Ik Soo Kim ,  Jun Kwan Kim ,  Jinsub Kim ,  Yongjin Shin

IPC: H01L27/11539 ,  H01L27/11519 ,  H01L27/11578 ,  H01L27/11565 ,  H01L27/11573 ,  H01L27/11551

Abstract: A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.

公开(公告)号：US20220086554A1

公开(公告)日：2022-03-17

申请号：US17536453

申请日：2021-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Ho Lee ,  Yong-Yi Kim ,  Chungsoon Park ,  Yongjin Shin

IPC: H04R1/10

Abstract: A mobile communication device is provided. The mobile communication device is operable to communicate with a wireless audio earphone including a first audio earpiece and a second audio earpiece. The mobile communication device includes a microphone; a touch screen; a wireless communication circuit; and a processor coupled to the microphone, the touch screen, and the wireless communication The processor is configured to control the wireless communication circuit to establish a wireless connection with the wireless audio earphone, display a user interface on the touch screen to receive a user input, obtain the user input for setting the microphone of the mobile communication device as a remote microphone, and while the microphone of the mobile communication device is set as the remote microphone, obtain sound via the microphone of the mobile communication device and control the wireless communication circuit to transmit audio data, corresponding to the sound obtained via the microphone, to the wireless audio earphone so that the wireless audio earphone outputs the sound corresponding to a remote location where the mobile communication device is placed.