INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250054822A1

    公开(公告)日:2025-02-13

    申请号:US18654799

    申请日:2024-05-03

    Abstract: An integrated circuit device includes a first semiconductor substrate having a frontside surface and a backside surface, a front-end-of-line (FEOL) structure on the frontside surface of the first semiconductor substrate, the FEOL structure including a plurality of fin-type active regions, a back-end-of-line (BEOL) structure on the FEOL structure, a second BEOL structure on the backside surface of the first semiconductor substrate, and a second semiconductor substrate spaced apart from the first semiconductor substrate in the vertical direction with the FEOL structure and the first BEOL structure therebetween, wherein a Young's modulus of a first crystal orientation extending parallel to the frontside surface of the first semiconductor substrate is different from a Young's modulus of a second crystal orientation that overlaps the first crystal orientation in the vertical direction and extends parallel to the first crystal orientation in the second semiconductor substrate.

    Magnetic resonance imaging apparatus

    公开(公告)号:US10363001B2

    公开(公告)日:2019-07-30

    申请号:US14684940

    申请日:2015-04-13

    Abstract: Disclosed herein is a magnetic resonance imaging apparatus. The magnetic resonance imaging apparatus includes a table disposed in a cavity which is formed in a bore, a head support having a support hole through which an upper surface of the table is visible to an object disposed on the table, and a display configured to display a graphical user interface (GUI) image, the display being disposed between the table and the head support.

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