公开(公告)号：US20230298908A1

公开(公告)日：2023-09-21

申请号：US18114235

申请日：2023-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daewoo Hwangbo ,  Bogeun Kim ,  Kyungnam Kang ,  Changhoon Kwak ,  Youngju Ro ,  Joonghoon Lee

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67248 ,  F16L59/065

Abstract: A heating jacket wrapping a pipe of semiconductor manufacturing equipment includes an internal shell wrapping an outer circumference of the pipe and having an insulation function, a heating line arranged on the outside of an internal shell, a vacuum insulation panel (VIP) wrapping the outside of the heating line, and an external shell wrapping an external surface of the VIP and having an insulation function. A plurality of heating jackets are connected to one another in a longitudinal direction of the pipe. Temperature sensors are arranged in some of the plurality of heating jackets. Temperature sensors are not arranged in the others of the plurality of heating jackets.