公开(公告)号：US20230298908A1

公开(公告)日：2023-09-21

申请号：US18114235

申请日：2023-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daewoo Hwangbo ,  Bogeun Kim ,  Kyungnam Kang ,  Changhoon Kwak ,  Youngju Ro ,  Joonghoon Lee

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67248 ,  F16L59/065

Abstract: A heating jacket wrapping a pipe of semiconductor manufacturing equipment includes an internal shell wrapping an outer circumference of the pipe and having an insulation function, a heating line arranged on the outside of an internal shell, a vacuum insulation panel (VIP) wrapping the outside of the heating line, and an external shell wrapping an external surface of the VIP and having an insulation function. A plurality of heating jackets are connected to one another in a longitudinal direction of the pipe. Temperature sensors are arranged in some of the plurality of heating jackets. Temperature sensors are not arranged in the others of the plurality of heating jackets.

公开(公告)号：US20250022995A1

公开(公告)日：2025-01-16

申请号：US18772193

申请日：2024-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilseop Won ,  Changhoon Kwak ,  Chulsoo Yoon ,  DONGSOO LEE ,  Seunggyun Jung ,  Sujong Han

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting device package includes a circuit board, a light-emitting device mounted on the circuit board, a reflective sheet disposed on the circuit board, the reflective sheet including an opening penetrating through the reflective sheet, wherein the light-emitting device is disposed within the opening, an inclined portion surrounding the opening when viewed in a plan view, and being inclined at a first angle with respect to an upper surface of the circuit board, and a flat extension portion surrounding the inclined portion when viewed in a plan view, and being parallel to the upper surface of the circuit board, and a diffuser plate disposed at a first vertical distance from the upper surface of the circuit board. An air gap is disposed between the upper surface of the circuit board and the flat extension portion.

公开(公告)号：US11195822B2

公开(公告)日：2021-12-07

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/54

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.

公开(公告)号：US20210066260A1

公开(公告)日：2021-03-04

申请号：US16862648

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Joon Pyeon ,  Changhoon Kwak ,  Moonsub Kim ,  Sangsu Kim ,  Myoungsun Ha

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.