公开(公告)号：US20210151411A1

公开(公告)日：2021-05-20

申请号：US17038946

申请日：2020-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsang CHO

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/367 ,  H01L23/00

Abstract: A semiconductor package includes: a first package substrate; a first semiconductor device mounted on the first package substrate; a second package substrate arranged on an upper part of the first semiconductor device; and a heat-dissipating material layer arranged between the first semiconductor device and the second package substrate and having a thermal conductivity of approximately 0.5 W/m·K to approximately 20 W/m·K, wherein the heat-dissipating material layer is in direct contact with an upper surface of the first semiconductor device and a conductor of the second package substrate.

公开(公告)号：US20240371718A1

公开(公告)日：2024-11-07

申请号：US18507369

申请日：2023-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehan YOUN ,  Youngsang CHO ,  Kyoung-Min LEE ,  Junho HUH

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065

Abstract: A semiconductor package includes a first package substrate including a first redistribution layer, at least one semiconductor chip disposed on the first redistribution layer and including a semiconductor device, and a second package substrate disposed on the at least one semiconductor chip and including a second redistribution layer. The at least one semiconductor chip includes at least one heat dissipation via having one end adjacent to the semiconductor device and penetrating through at least a portion of the at least one semiconductor chip, and another end contacting the second package substrate. The at least one heat dissipation via is a dissipation path of heat generated from the semiconductor device.

公开(公告)号：US20250047341A1

公开(公告)日：2025-02-06

申请号：US18660858

申请日：2024-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongyeon KIM ,  Youngsang CHO

IPC: H04B7/06 ,  H01Q21/24 ,  H04B1/401

Abstract: An electronic device is provided. The electronic device includes at least one processor, memory storing instructions, a first antenna, a second antenna, a radio frequency (RF) transceiver, a phase shifter electrically connected to the second antenna, a power branch circuit, and at least one switch circuit configured to selectively provide a first connection state or a second connection state. The instructions that, when executed by the at least one processor, cause the electronic device to control the at least one switch circuit to provide a first connection state or a second connection state.

公开(公告)号：US20230061795A1

公开(公告)日：2023-03-02

申请号：US17983487

申请日：2022-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.

公开(公告)号：US20200328187A1

公开(公告)日：2020-10-15

申请号：US16592897

申请日：2019-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.