公开(公告)号：US10770446B2

公开(公告)日：2020-09-08

申请号：US16201021

申请日：2018-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Lyong Kim ,  Jin-woo Park ,  Choongbin Yim ,  Younji Min

IPC: H01L23/58 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L25/10 ,  H01L21/683 ,  H01L25/065 ,  H01L21/56

Abstract: Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, an interconnect substrate spaced apart from the semiconductor chip on the substrate and including a conductive member therein, a solder ball on the interconnect substrate and electrically connected to the conductive member, a polymer layer on the interconnect substrate and the semiconductor chip and including an opening through which the solder ball is exposed, and polymer particles in the solder ball and including the same material as the polymer layer.

公开(公告)号：US10177131B2

公开(公告)日：2019-01-08

申请号：US15442001

申请日：2017-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Lyong Kim ,  Jin-woo Park ,  Choongbin Yim ,  Younji Min

IPC: H01L25/00 ,  H01L23/538 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H01L21/56

Abstract: Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, an interconnect substrate spaced apart from the semiconductor chip on the substrate and including a conductive member therein, a solder ball on the interconnect substrate and electrically connected to the conductive member, a polymer layer on the interconnect substrate and the semiconductor chip and including an opening through which the solder ball is exposed, and polymer particles in the solder ball and including the same material as the polymer layer.