公开(公告)号：US10105102B2

公开(公告)日：2018-10-23

申请号：US14703833

申请日：2015-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mitsuo Umemoto ,  Yung-Cheol Kong ,  Woon-Bae Kim ,  Pyoung-Wan Kim ,  Kyong-Soon Cho

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/0215

Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

公开(公告)号：US20140073079A1

公开(公告)日：2014-03-13

申请号：US14016256

申请日：2013-09-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-Hoe Cho ,  Byoung-Rim Seo ,  Yung-Cheol Kong ,  Han-Sung Ryu

IPC: H01L27/146

CPC classification number: H01L27/14683 ,  H04N5/2252 ,  H04N5/2253 ,  Y10T29/49117

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract translation: 相机模块包括图像传感器芯片，其包括具有第一和第二相对表面的基板和在第一表面上的接地焊盘，围绕图像传感器芯片的侧面但使图像传感器芯片的第二表面露出的壳体， 与壳体结合的电磁波屏蔽膜，以及电连接到接地垫的电导体。 相机模块还具有设置在壳体中的图像传感器芯片的第一表面上的光学单元，以将来自物体的光引导到图像传感器芯片。 电导体延伸穿过壳体的一侧。 导体还与电磁波屏蔽膜接触，将接地焊盘和电磁波屏蔽膜电连接。

公开(公告)号：US08927316B2

公开(公告)日：2015-01-06

申请号：US14016256

申请日：2013-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hoe Cho ,  Byoung-Rim Seo ,  Yung-Cheol Kong ,  Han-Sung Ryu

IPC: H01L21/00

CPC classification number: H01L27/14683 ,  H04N5/2252 ,  H04N5/2253 ,  Y10T29/49117

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract translation: 相机模块包括图像传感器芯片，其包括具有第一和第二相对表面的基板和在第一表面上的接地焊盘，围绕图像传感器芯片的侧面但使图像传感器芯片的第二表面露出的壳体， 与壳体结合的电磁波屏蔽膜，以及电连接到接地垫的电导体。 相机模块还具有设置在壳体中的图像传感器芯片的第一表面上的光学单元，以将来自物体的光引导到图像传感器芯片。 电导体延伸穿过壳体的一侧。 导体还与电磁波屏蔽膜接触，将接地焊盘和电磁波屏蔽膜电连接。