公开(公告)号：US10105102B2

公开(公告)日：2018-10-23

申请号：US14703833

申请日：2015-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mitsuo Umemoto ,  Yung-Cheol Kong ,  Woon-Bae Kim ,  Pyoung-Wan Kim ,  Kyong-Soon Cho

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/0215

Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

公开(公告)号：US20130193545A1

公开(公告)日：2013-08-01

申请号：US13749178

申请日：2013-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Gyu Jeong ,  Young-Shin Kwon ,  Pyoung-Wan Kim ,  Seung-Kon Mok ,  Hyun-Su Jun

IPC: H01L31/0236 ,  H01L29/30

CPC classification number: H01L31/0236 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/30 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor apparatus and a method of fabricating the same are provided. The semiconductor apparatus includes a body part having a first surface and a second surface facing each other, a first trench formed into the first surface of the body part, a second trench formed into the second surface of the body part, an opening connecting the first trench and the second trench to each other, a first adhesion enhancer, such as a rough surface, formed on a bottom surface of the first trench, and a second adhesion enhancer, such as a rough surface, formed on the second surface of the body part.

Abstract translation: 提供半导体装置及其制造方法。 该半导体装置包括具有第一表面和彼此面对的第二表面的主体部分，形成在主体部分的第一表面中的第一沟槽，形成在主体部分的第二表面中的第二沟槽，连接第一 沟槽和第二沟槽，形成在第一沟槽的底表面上的第一粘附增强剂，例如粗糙表面，以及形成在主体的第二表面上的第二粘附增强剂，例如粗糙表面 部分。