公开(公告)号：US10269111B2

公开(公告)日：2019-04-23

申请号：US15597262

申请日：2017-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonseo Song ,  Sung Yoon Ryu ,  Wahseng Yap ,  Yunjung Jee ,  Yusin Yang ,  Chungsam Jun ,  Yoo Jin Jeoung ,  Jaehyung Ahn ,  Janghee Lee

IPC: G06T7/00

Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.

公开(公告)号：US10088297B2

公开(公告)日：2018-10-02

申请号：US15464896

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon Ryu ,  Younghoon Sohn ,  Yusin Yang ,  Chungsam Jun ,  Yunjung Jee

IPC: G01B9/02 ,  G01B11/06

Abstract: Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

公开(公告)号：US20180053292A1

公开(公告)日：2018-02-22

申请号：US15597262

申请日：2017-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonseo Song ,  Sung Yoon Ryu ,  Wahseng Yap ,  Yunjung Jee ,  Yusin Yang ,  Chungsam Jun ,  Yoo Jin Jeoung ,  Jaehyung Ahn ,  Janghee Lee

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/30148

Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.