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公开(公告)号：US11754517B2
公开(公告)日：2023-09-12
申请号：US17175173
申请日：2021-02-12
发明人： Suyoung Lee , Jongmin Kim , Ilsuk Park , Kwangil Shin , Chungsam Jun
IPC分类号： G06K9/00 , G01N23/225 , G01N23/221 , G06T7/00
CPC分类号： G01N23/225 , G01N23/221 , G06T7/001 , G01N2223/401 , G01N2223/6116 , G01N2223/6462 , G06T2207/30148
摘要： An inspection apparatus and a method of inspecting a semiconductor device are disclosed. The inspection apparatus includes a stage on which a semiconductor device is positioned, a first light source irradiating a high-frequency light onto an inspection area of the semiconductor device to reduce a potential barrier of a PN junction in the semiconductor device, a beam scanner arranged over the semiconductor device and irradiating a charged particle beam onto the inspection area of the semiconductor device to generate secondary electrons, and a defect detector generating a detection image corresponding to the inspection area and detecting, based on a voltage contrast between a reference image and a plurality of detection images, a defect image indicating a defect in the semiconductor device from among the plurality of detection images.
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公开(公告)号：US09612212B1
公开(公告)日：2017-04-04
申请号：US14954158
申请日：2015-11-30
发明人： Choonshik Leem , Chungsam Jun
IPC分类号： G01N21/00 , G01N21/956 , G01N21/21 , G01N21/88 , H01L21/66 , H01L21/768
CPC分类号： G01N21/956 , G01N21/211 , G01N21/8806 , G01N2021/8848 , G01N2201/0683 , G01N2201/12 , H01L21/76816 , H01L21/76877 , H01L22/12
摘要： An ellipsometer includes a stage, a light source, a polarizer, a detector, and a processor. The stage is configured to support a substrate including a pattern. The light source is configured to emit illumination toward the substrate. The polarizer is configured to polarize the illumination. The detector is configured to generate, in association with a plurality of azimuthal angles, data corresponding to polarized illumination reflected from the substrate. The processor is configured to: control rotation of the stage in association with sequential inspection of the pattern at the plurality of azimuthal angles, and determine asymmetry of the pattern based on the data. Each azimuthal angle of the plurality of azimuthal angles corresponds to a different rotational state of the stage.
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公开(公告)号：US11988495B2
公开(公告)日：2024-05-21
申请号：US17156049
申请日：2021-01-22
发明人： Kwangsoo Kim , Sungyoon Ryu , Daejun Park , Seong Yun , Seungryeol Oh , Sujin Lee , Jaeyong Lee , Minho Rim , Chungsam Jun , Myungjun Lee
CPC分类号： G01B11/02 , G01N21/8806 , G01N21/8851 , G03F7/70625 , G03F7/7065 , G01B2210/56 , G01N2021/8887
摘要： Provided is a through-focus image-based metrology device including an optical device, and a computing device configured to acquire at least one through-focus image of a target from the optical device, generate an intensity profile based on the acquired at least one through-focus image, and perform metrology on the target based on the generated intensity profile, wherein the optical device includes a stage on which the target is disposed, the stage being configured to move by one step in at least one direction based on control of the computing device, and to acquire the at least one through-focus image, an image sensor disposed on the stage, an objective lens disposed between the image sensor and the stage, the objective lens being configured to transmit reflected light from the target, and a light source configured to emit illumination light to the target through the objective lens.
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公开(公告)号：US20240019380A1
公开(公告)日：2024-01-18
申请号：US18219494
申请日：2023-07-07
发明人： Kihong Chung , Kiwook Song , Seungryeol Oh , Chungsam Jun
CPC分类号： G01N21/9501 , G01N21/29 , G01N21/211 , G01N23/2251 , G01B15/02 , G01N21/8851 , G01B2210/56 , G01N2223/6116 , G01N2021/213 , G01N2021/8864 , H01L22/12
摘要： A substrate inspection method includes radiating light onto a substrate, extracting a spectrum representing an intensity of light according to a wavelength from a light reflected from the substrate, analyzing the extracted spectrum in units of each of an entire substrate, a shot, a chip, and a block, generating a spectrum distribution map indicating reflectivity for each wavelength band by using the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.
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公开(公告)号：US20180096903A1
公开(公告)日：2018-04-05
申请号：US15832938
申请日：2017-12-06
发明人： Younghoon Sohn , Jinsung Kim , Yusin Yang , Chungsam Jun
IPC分类号： H01L21/66 , H01L23/00 , H01L21/027 , H01L21/311 , H01L21/768 , H01L21/56 , H01L21/67 , H01L21/683 , H01L21/48 , H01L21/02
CPC分类号： H01L22/12 , H01L21/02164 , H01L21/0217 , H01L21/02271 , H01L21/0274 , H01L21/31144 , H01L21/4846 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67259 , H01L21/6835 , H01L21/76802 , H01L21/76895 , H01L22/20 , H01L23/3128 , H01L24/06 , H01L24/11 , H01L2221/68345 , H01L2224/02311 , H01L2224/04105 , H01L2224/12105 , H01L2224/13024 , H01L2224/14131 , H01L2224/96 , H01L2924/1433 , H01L2924/1434 , H01L2924/15153 , H01L2924/152 , H01L2924/15747
摘要： A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.
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公开(公告)号：US20210396510A1
公开(公告)日：2021-12-23
申请号：US17156049
申请日：2021-01-22
发明人： Kwangsoo Kim , Sungyoon Ryu , Daejun Park , Seong Yun , Seungryeol Oh , Sujin Lee , Jaeyong Lee , Minho Rim , Chungsam Jun , Myungjun Lee
摘要： Provided is a through-focus image-based metrology device including an optical device, and a computing device configured to acquire at least one through-focus image of a target from the optical device, generate an intensity profile based on the acquired at least one through-focus image, and perform metrology on the target based on the generated intensity profile, wherein the optical device includes a stage on which the target is disposed, the stage being configured to move by one step in at least one direction based on control of the computing device, and to acquire the at least one through-focus image, an image sensor disposed on the stage, an objective lens disposed between the image sensor and the stage, the objective lens being configured to transmit reflected light from the target, and a light source configured to emit illumination light to the target through the objective lens.
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公开(公告)号：US09719946B2
公开(公告)日：2017-08-01
申请号：US15449423
申请日：2017-03-03
发明人： Choonshik Leem , Chungsam Jun
IPC分类号： H01L21/00 , G01N21/956 , G01N21/21 , G01N21/88 , H01L21/66
CPC分类号： G01N21/956 , G01N21/211 , G01N21/8806 , G01N2021/8848 , G01N2201/0683 , G01N2201/12 , H01L21/76816 , H01L21/76877 , H01L22/12
摘要： An ellipsometer includes a stage, a light source, a polarizer, a detector, and a processor. The stage is configured to support a substrate including a pattern. The light source is configured to emit illumination toward the substrate. The polarizer is configured to polarize the illumination. The detector is configured to generate, in association with a plurality of azimuthal angles, data corresponding to polarized illumination reflected from the substrate. The processor is configured to: control rotation of the stage in association with sequential inspection of the pattern at the plurality of azimuthal angles, and determine asymmetry of the pattern based on the data. Each azimuthal angle of the plurality of azimuthal angles corresponds to a different rotational state of the stage.
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8.发明授权Method of manufacturing a semiconductor device using semiconductor measurement system 有权使用半导体测量系统制造半导体器件的方法公开(公告)号：US09583402B2
公开(公告)日：2017-02-28
申请号：US14794813
申请日：2015-07-09
发明人： Sung Yoon Ryu , Wooseok Ko , Souk Kim , Yusin Yang , Sangkil Lee , Chungsam Jun , Kwanwoo Ryu
CPC分类号： H01L22/12 , H01L21/67173 , H01L22/20
摘要： A method includes loading a substrate into a sensing chamber; while the substrate is in the sensing chamber, performing a spectral analysis of the substrate; transferring the substrate between the sensing chamber and a processing chamber coupled to the sensing chamber; processing the substrate in the processing chamber to form at least a first layer and/or pattern on the substrate; and based on at least the spectral analysis, determining whether a parameter resulting from the formation of first layer and/or pattern is satisfied.
摘要翻译： 一种方法包括将衬底加载到感测室中; 同时衬底在感测室中，对衬底进行光谱分析; 在所述感测室和耦合到所述感测室的处理室之间传送所述衬底; 在所述处理室中处理所述衬底以在所述衬底上形成至少第一层和/或图案; 并且至少基于光谱分析，确定是否满足形成第一层和/或图案所引起的参数。
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公开(公告)号：US12130242B2
公开(公告)日：2024-10-29
申请号：US18446837
申请日：2023-08-09
发明人： Doyoung Yoon , Jeongho Ahn , Dongryul Lee , Dongchul Ihm , Chungsam Jun
IPC分类号： G01N21/95 , G01N21/88 , G01N21/956 , H01L21/66
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/956 , H01L22/12
摘要： A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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公开(公告)号：US11754510B2
公开(公告)日：2023-09-12
申请号：US17501318
申请日：2021-10-14
发明人： Doyoung Yoon , Jeongho Ahn , Dongryul Lee , Dongchul Ihm , Chungsam Jun
IPC分类号： G01N21/95 , H01L21/66 , G01N21/88 , G01N21/956
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/956 , H01L22/12
摘要： A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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