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公开(公告)号：US20250167051A1
公开(公告)日：2025-05-22
申请号：US18765917
申请日：2024-07-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seonghyeon Hwang , Euijong Whang , Hyunsoo Kwak , Sung Yoon Ryu , Sooseok Lee , Younghoon Sohn
Abstract: A method of operating an electronic device includes selecting, by at least one processor, M first sample-label pairs (M being a positive integer); obtaining, by the at least one processor, M K-values; selecting, by the at least one processor, M second sample-label pairs respectively corresponding to the M first sample-label pairs based on the M K-values, generating, by the at least one processor, M third sample-label pairs based on the M first sample-label pairs and the M second sample-label pairs, and training, by the at least one processor, a regression analysis module based on the M third sample-label pairs, and the regression analysis module is trained to predict labels, which are associated with the semiconductor device, from the M third sample-label pairs.
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2.发明公开公开(公告)号：US20230367079A1
公开(公告)日：2023-11-16
申请号：US18096255
申请日：2023-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung-Il Choi , Hyong Joon Kim , Jong Koo Im , Kyung Beom Kim , Sung Yoon Ryu , Mi Ra Park , Jeong Han Yi , Jeung Hee Lee
IPC: G02B6/36
CPC classification number: G02B6/3652 , G01N21/9501
Abstract: A light source uniformity adjusting device is provided, which easily and exactly performs a coiling task of an optical fiber. The light source uniformity adjusting device includes a base plate including a plurality of holes therein; a first fixing portion on one side of the base plate, fixing a first portion of an optical fiber; a second fixing portion disposed on another side of the base plate, fixing a second portion of the optical fiber; and a post portion inserted into at least one hole from among the plurality of holes, the post portion routing the optical fiber on the base plate such that the optical fiber has at least one curved shape between the first portion and the second portion.
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公开(公告)号：US10551326B2
公开(公告)日：2020-02-04
申请号：US15855520
申请日：2017-12-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyo Hyeong Kang , Kang Woong Ko , Sung Yoon Ryu , Gil Woo Song , Jae Hyung Ahn , Chul Hyung Yoo , Kyoung Hwan Lee , Sung Ho Jang , Yong Ju Jeon , Hyoung Jo Jeon
Abstract: A method for measuring a semiconductor device is provided. A method for measuring a semiconductor device includes defining an interest area and an acceptable area in a chip area on a wafer; performing a first measurement of the chip area with a spectral imaging device to acquire spectrum data of the chip area; assuming the distribution of the spectrum data of a first pixel in the acceptable area is a normal distribution; calculating a distance from a central point on the normal distribution to second pixels in the interest area; selecting a position of a second pixel having a distance from the central point on the normal distribution greater than a predetermined range, among the second pixels, as a candidate position; and performing a second measurement of the candidate position.
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公开(公告)号：US20250076116A1
公开(公告)日：2025-03-06
申请号：US18442539
申请日：2024-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunhong Jun , Sung Yoon Ryu , Younghoon Sohn , Eunsoo Hwang
Abstract: An optical module includes: a diffraction grating configured to rotate and focus a beam, which is incident thereon from an incident path, onto a Fourier plane, a digital micromirror array (DMD) configured to assign a frequency for each wavelength of the focused beam received at the Fourier plane, and perform a Fourier transform for each frequency, and a first optical fiber configured to receive a beam that is reflected back from the DMD back and the diffraction grating, and along the incident path.
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5.发明申请公开(公告)号：US20190170563A1
公开(公告)日：2019-06-06
申请号：US16013199
申请日：2018-06-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangkil Lee , Yusin Yang , Sung Yoon Ryu , Q-Han Park , Hyun Lee
Abstract: Disclosed are mass flow controllers, apparatuses for manufacturing semiconductor devices, and methods of maintenance thereof. The mass flow controller may control an amount of a gas provided into a chamber. The mass flow controller may be configured to obtain an absolute volume of the gas provided into the chamber at a standard flow rate when the mass flow controller is initially used. The mass flow controller may be configured to obtain a detected flow rate of the gas provided at a measured flow rate after the mass flow controller has been used for a predetermined time. The mass flow controller may be configured to compare the detected flow rate and the standard flow rate to verify a full-scale error in the measured flow rate.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170200658A1
公开(公告)日：2017-07-13
申请号：US15366964
申请日：2016-12-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yusin Yang , Kang-Woong Ko , Sung Yoon Ryu , Gil-Woo Song , Sangkil Lee , Chungsam Jun , HyoungJo Jeon , Masahiro Horie
Abstract: A method of inspecting a substrate includes irradiating light onto a substrate that has experienced a first process, obtaining spectral data of the light reflected from the substrate, detecting a defect region of the substrate from the spectral data, and extracting a first defect site that occurred in or during the first process from the defect region. Extracting the first defect site includes establishing an effective area where the first process affects the substrate, and extracting a superimposed area that is overlapped with the effective area from the defect region. The superimposed area is defined as the first defect site.
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公开(公告)号：US20240355666A1
公开(公告)日：2024-10-24
申请号：US18636612
申请日：2024-04-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung-Il Choi , Seong-Eun Kang , Kyung Beom Kim , Sung Yoon Ryu , Mi Ra Park , Yong Kyu Lee , Jeung Hee Lee , Ju Hyun Lee , Nam Young Cho
IPC: H01L21/683 , H01L21/687
CPC classification number: H01L21/6838 , H01L21/68707
Abstract: A substrate transferring apparatus includes a support plate including an upper surface on which a substrate is configured to be seated, and a vacuum pad detachably coupled to the support plate and configured to vacuum suction the substrate to fix the substrate on the upper surface of the support plate, wherein the vacuum pad includes a suction area and a support protrusion surrounding the suction area, an upper surface of the support protrusion is at a higher vertical level than an upper surface of the suction area to support the substrate, and the upper surface of the support protrusion is inclined relative to horizontal.
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公开(公告)号：US10585115B2
公开(公告)日：2020-03-10
申请号：US16130699
申请日：2018-09-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Duck Mahn Oh , Sung Yoon Ryu , Young Hoon Sohn , Chung Sam Jun , Yun Jung Jee
Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.
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9.发明授权Method of manufacturing a semiconductor device using semiconductor measurement system 有权使用半导体测量系统制造半导体器件的方法公开(公告)号：US09583402B2
公开(公告)日：2017-02-28
申请号：US14794813
申请日：2015-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung Yoon Ryu , Wooseok Ko , Souk Kim , Yusin Yang , Sangkil Lee , Chungsam Jun , Kwanwoo Ryu
CPC classification number: H01L22/12 , H01L21/67173 , H01L22/20
Abstract: A method includes loading a substrate into a sensing chamber; while the substrate is in the sensing chamber, performing a spectral analysis of the substrate; transferring the substrate between the sensing chamber and a processing chamber coupled to the sensing chamber; processing the substrate in the processing chamber to form at least a first layer and/or pattern on the substrate; and based on at least the spectral analysis, determining whether a parameter resulting from the formation of first layer and/or pattern is satisfied.
Abstract translation: 一种方法包括将衬底加载到感测室中; 同时衬底在感测室中，对衬底进行光谱分析; 在所述感测室和耦合到所述感测室的处理室之间传送所述衬底; 在所述处理室中处理所述衬底以在所述衬底上形成至少第一层和/或图案; 并且至少基于光谱分析，确定是否满足形成第一层和/或图案所引起的参数。
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公开(公告)号：US11004712B2
公开(公告)日：2021-05-11
申请号：US16532920
申请日：2019-08-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung Yoon Ryu , Joonseo Song , Souk Kim , Younghoon Sohn , Yusin Yang , Chihoon Lee
Abstract: Disclosed are methods of inspecting semiconductor wafers, inspection systems for performing the same, and methods of fabricating semiconductor devices using the same. A method of inspecting a semiconductor wafer including preparing a wafer including zones each having patterns, obtaining representative values for the patterns, scanning the patterns under an optical condition to obtain optical signals for the patterns, each of the optical signals including optical parameters, selecting a representative optical parameter that is one of the optical parameters that has a correlation with the representative values, obtaining a reference value of the representative optical parameter for a reference pattern, and obtaining a defect of an inspection pattern by comparing the reference value with an inspection value of the representative optical parameter for the inspection pattern.
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