HEAD GIMBAL ASSEMBLY SOLDER JOINTS AND FORMATION THEREOF USING BOND PAD SOLDER DAMS

    公开(公告)号:US20190122694A1

    公开(公告)日:2019-04-25

    申请号:US15788886

    申请日:2017-10-20

    Abstract: A magnetic recording head including a trailing surface and a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, and a top edge extending between the two side edges. The head further includes at least one solder dam including a nonwettable, electrically conductive solder material positioned adjacent to the top edge of at least one of the bond pads.

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