公开(公告)号：US20230387650A1

公开(公告)日：2023-11-30

申请号：US18301989

申请日：2023-04-17

Applicant: Senko Advanced Components, Inc.

Inventor： Yang CHEN ,  Robert Ryan VALLANCE ,  King-Fu HII

IPC: H01S5/02255 ,  H01S5/02253

CPC classification number: H01S5/02255 ,  H01S5/02253 ,  H01S5/4031

Abstract: An LBM package and method for packaging an LBM using a stamped metallic mirror array that folds light beams, correct beam shapes, fold and/or redirect beam propagations. The mirror array can be integrated or assembled inside an LBM to provide beam shaping and redirection of the high-power beams near the laser diode. The LBM incorporates a stamped metallic freeform mirror or reflector with an off-axis parabolic shape is configured to fold and collimate laser beam. A precision stamping process is deployed to produce an array of miniature, freeform mirrors in high volume applications. The mirror array simplifies the optical path and eliminates passive components such as refractive lenses and dichroic filters that combine RGB beams. Stamped metallic optical components with micro-scale freeform mirrors in the LBM are tolerant of high temperatures and can thermally diffuse heat away from the reflective surface for high power applications.