公开(公告)号：US20240305066A1

公开(公告)日：2024-09-12

申请号：US18594502

申请日：2024-03-04

Applicant: NICHIA CORPORATION

Inventor： Hiroshi MARUYAMA

IPC: H01S5/40 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02375

CPC classification number: H01S5/4093 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02375

Abstract: A light-emitting device includes a base, first to third light-emitting elements, one or more reflective members, and a lens member. The second and third light-emitting elements are disposed on lateral sides of the first light-emitting element, respectively. The mounting surface of the base is warped such that positions where the second and third light-emitting elements are disposed are lower than a position where the first light-emitting element is disposed, and the light-emitting surfaces of the second and third light-emitting elements are located more on a front side than the light-emitting surface of the first light-emitting element, or the positions where the second and third light-emitting elements are disposed are higher than the position where the first light-emitting element is disposed, and the light-emitting surfaces of the second and third light-emitting elements are both located more on a back side than the light-emitting surface of the first light-emitting element.

公开(公告)号：US12040588B2

公开(公告)日：2024-07-16

申请号：US17295297

申请日：2019-11-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Jander

IPC: H01S5/02257 ,  H01S5/00 ,  H01S5/02216 ,  H01S5/02255 ,  H01S5/40

CPC classification number: H01S5/02216 ,  H01S5/0064 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/4093

Abstract: In one embodiment, the semiconductor laser comprises a housing in which multiple laser diode chips are encapsulated. The housing comprises a cover panel and/or a lateral wall which is permeable to the generated laser radiation. The cover panel and/or the lateral wall has a light outlet surface with adjacent outlet regions. Each of the outlet regions is paired with precisely one of the laser diode chips. The light outlet surface is arranged downstream of a light outlet plane. The cover panel and/or the lateral wall has a different average thickness in the outlet regions such that the optical wavelength for the laser radiation of all of the laser diode chips is the same up to the light outlet plane with a tolerance of maximally 1.5 μm.

公开(公告)号：US20240213738A1

公开(公告)日：2024-06-27

申请号：US18396443

申请日：2023-12-26

Applicant: NICHIA CORPORATION

Inventor： Masatoshi NAKAGAKI

IPC: H01S5/02255

CPC classification number: H01S5/02255

Abstract: A method for manufacturing a base portion configured to be used in a light-emitting device includes: providing a base body, the base body including a substrate formed of a metal material, the substrate having an upper surface, and a frame body formed of ceramics, the frame body being located around the upper surface of the substrate; and forming a recessed portion in the upper surface of the substrate, the recessed portion having a bottom surface including a planar region.

公开(公告)号：US20240154383A1

公开(公告)日：2024-05-09

申请号：US18404397

申请日：2024-01-04

Applicant: NICHIA CORPORATION

Inventor： Kiyoshi ENOMOTO

IPC: H01S5/02257 ,  H01S5/02216 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/40

CPC classification number: H01S5/02257 ,  H01S5/02216 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/4031 ,  H01S5/4093

Abstract: A base includes: a mount surface; a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions having first upper surfaces and located opposite to each other in a first direction that is parallel to a side of the mount surface, wherein each first protrusion has a same height from the mount surface, a pair of second protrusions having second upper surfaces and located opposite to each other in a second direction which is perpendicular to the first direction, wherein each second protrusion has a height from the mount surface less than the height of the first protrusion; and at least one conduction region disposed on at least one of the first upper surfaces and/or at least one of the second upper surfaces.

公开(公告)号：US20240113497A1

公开(公告)日：2024-04-04

申请号：US18257599

申请日：2021-12-08

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Baiming GUO ,  Qing WANG

IPC: H01S5/02255 ,  H01S5/02253

CPC classification number: H01S5/02255 ,  H01S5/02253 ,  H01S5/183

Abstract: An illumination module may include an emitter configured to emit light along an optical axis of the illumination module and an optical system located on or over the emitter. The optical system may include a curved surface where the curved surface is tilted in a first direction, such that the optical system introduces optical aberration in the first direction.

公开(公告)号：US20240097398A1

公开(公告)日：2024-03-21

申请号：US18517409

申请日：2023-11-22

Applicant: NICHIA CORPORATION

Inventor： Kazuma KOZURU

IPC: H01S5/02253 ,  H01S5/02255 ,  H01S5/02257

CPC classification number: H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  G03B21/2033

Abstract: A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.

公开(公告)号：US11892155B2

公开(公告)日：2024-02-06

申请号：US18298784

申请日：2023-04-11

Applicant: NICHIA CORPORATION

Inventor： Seiji Kiyota ,  Kazuma Kozuru ,  Eiichiro Okahisa

IPC: F21V5/00 ,  H01S5/00 ,  F21V5/04 ,  G02B19/00 ,  G02B3/00 ,  H01S5/40 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02345

CPC classification number: F21V5/007 ,  F21V5/04 ,  G02B3/0056 ,  G02B19/0057 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/405 ,  H01S5/4018 ,  H01S5/4025 ,  H01S5/02345

Abstract: A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

公开(公告)号：US20240022044A1

公开(公告)日：2024-01-18

申请号：US18253256

申请日：2021-11-19

Applicant: ams-OSRAM International GmbH

Inventor： Hubert Halbritter ,  Bruno Jentzsch ,  Christian Lauer ,  Peter Fuchs

IPC: H01S5/10 ,  H01S5/02255 ,  H01S5/028

CPC classification number: H01S5/1021 ,  H01S5/02255 ,  H01S5/1092 ,  H01S5/0287

Abstract: In an embodiment a semiconductor laser includes a semiconductor body having a plurality of resonator regions, wherein the resonator regions are arranged side by side along a lateral direction, each resonator region having an active region configured to generate radiation, wherein the semiconductor body extends between two side faces, wherein the resonator regions are configured to emit laser radiation at one of the two side faces, and a layer sequence attached to at least one of the side faces, wherein the layer sequence forms at least part of a resonator mirror for at least one resonator region.

公开(公告)号：US11837843B2

公开(公告)日：2023-12-05

申请号：US17478863

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura ,  Tatsuya Kanazawa

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02208 ,  H01S5/02255 ,  H01S5/02253 ,  H01S5/02257

CPC classification number: H01S5/0071 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/4037 ,  H01S5/4075 ,  H01S5/005 ,  H01S5/02257

Abstract: A light emitting device includes a base, a first semiconductor laser element, a second semiconductor laser element, a lens member, and a waveplate. The base has a bottom part. The first semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element is disposed on the bottom part of the base. The second semiconductor laser element has a different polarization direction from a polarization direction of the first semiconductor laser element. The lens member is a member into which light beams from the first semiconductor element and the second semiconductor laser element enter. The waveplate is configured to change the polarization direction of light from the first semiconductor laser element.

公开(公告)号：US20230299557A1

公开(公告)日：2023-09-21

申请号：US18182790

申请日：2023-03-13

Applicant: NICHIA CORPORATION

Inventor： Takuya HASHIMOTO ,  Soichiro MIURA

IPC: H01S5/0683 ,  H01S5/02257 ,  H01S5/40 ,  H01S5/02253 ,  H01S5/02255

CPC classification number: H01S5/0683 ,  H01S5/02257 ,  H01S5/4093 ,  H01S5/4031 ,  H01S5/02253 ,  H01S5/02255

Abstract: A light emitting device includes a first light-emitting element configured to emit a first light in a first direction, a second light-emitting element configured to emit a second light in the first direction, a package including a substrate and a cap, having a light emission surface through which the first light and second light emitted from the first and second light-emitting elements are passed, and forming a closed space in which the first and second light-emitting elements are located, one or more optical members that are spaced away from the light emission surface in the first direction, and that are configured to combine the first light and second light, and one or more photodetectors that are spaced away from the light emission surface in the first direction, and that are configured to receive the first light and second light.