公开(公告)号：US20240085633A1

公开(公告)日：2024-03-14

申请号：US18467449

申请日：2023-09-14

Applicant: Senko Advanced Components, Inc.

Inventor： Yang CHEN ,  Robert Ryan VALLANCE

IPC: G02B6/36

CPC classification number: G02B6/3616 ,  G02B6/364

Abstract: An optical connector module having a plurality of discrete optical benches inputting/outputting optical signals, each including: a base defining an array of reflective surfaces and supporting an array of optical fiber array defining optical channels with inputs/outputs in optical alignment with corresponding reflective surfaces, thereby forming optical inputs/outputs of the corresponding optical bench. A carrier commonly supports the optical benches, with the optical benches fixedly mount thereon in a desired spatial arrangement with the optical inputs/outputs of the optical benches matching optical inputs/outputs of the external optical component. The carrier is structured to physically connect to the external component. The carrier includes passive alignment features for demountable coupling to the external component, wherein the carrier is at least one of directly mounted to the top of the external component, or detachably mounted to the external component via a receptacle or foundation positioned relative to the inputs/outputs of the external component.

公开(公告)号：US20230123751A1

公开(公告)日：2023-04-20

申请号：US17969543

申请日：2022-10-19

Applicant: Senko Advanced Components, Inc.

Inventor： Robert Ryan VALLANCE ,  Yang CHEN

IPC: G02B6/42

Abstract: An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

公开(公告)号：US20230076055A1

公开(公告)日：2023-03-09

申请号：US17985815

申请日：2022-11-11

Applicant: Senko Advanced Components, Inc.

Inventor： Robert Ryan VALLANCE ,  Yang CHEN ,  Tewodros MENGESHA

IPC: G02B6/42 ,  G02B6/30

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions. The optical connector is removably attachable to the foundation to define a demountable coupling, with the first array of alignment features against the second array of alignment features to define an elastic averaging coupling.

公开(公告)号：US20240142722A1

公开(公告)日：2024-05-02

申请号：US18496841

申请日：2023-10-28

Applicant: Senko Advanced Components, Inc.

Inventor： Yang CHEN ,  Robert Ryan VALLANCE

IPC: G02B6/38

CPC classification number: G02B6/3885

Abstract: A passive optical alignment coupling between two bodies each having a complementary interstitial two-dimensional planar array of protrusions defining an array of interstices. Each array of protrusions defines an array of discrete protrusions separated and isolated from one another on the surface of the corresponding bodies. When the bodies are pressed together, the array of protrusions defined on one body intermesh with protrusions defined on the other body with protrusions of one body received in corresponding interstices defined on the other body. The protrusion surfaces of each adjacent pair of protrusions are in point contact. The first body is removably attachable to the second body to define a demountable coupling, with the first array of alignment features against the second array of alignment features to define an elastic averaging coupling, thereby passively aligning the first body to the second body.

公开(公告)号：US20240027703A1

公开(公告)日：2024-01-25

申请号：US18350745

申请日：2023-07-11

Applicant: Senko Advanced Components, Inc.

Inventor： Yang CHEN ,  Robert Ryan VALLANCE

IPC: G02B6/42

CPC classification number: G02B6/4228 ,  G02B6/4214

Abstract: A demountable connection of an optical connector using a foundation having features for integrated optical coupling and demountable coupling. The foundation provides for demountable passive alignment connection to an optical connector. The foundation is permanently attached and aligned to a PIC chip. The foundation includes optical elements that redirect and reshape incident light to follow a desired light beam shape and path between the optical connector and the optoelectronic device. The foundation may include a combination of different optical elements having optical properties that produces the desired light beam quality and direction. The foundation also includes passive alignment features that matches the passive alignment features on the facing side of the optical connector. The foundation has a unitary, monolithic body that is provided with the optical elements and the passive alignment features.

公开(公告)号：US20230387650A1

公开(公告)日：2023-11-30

申请号：US18301989

申请日：2023-04-17

Applicant: Senko Advanced Components, Inc.

Inventor： Yang CHEN ,  Robert Ryan VALLANCE ,  King-Fu HII

IPC: H01S5/02255 ,  H01S5/02253

CPC classification number: H01S5/02255 ,  H01S5/02253 ,  H01S5/4031

Abstract: An LBM package and method for packaging an LBM using a stamped metallic mirror array that folds light beams, correct beam shapes, fold and/or redirect beam propagations. The mirror array can be integrated or assembled inside an LBM to provide beam shaping and redirection of the high-power beams near the laser diode. The LBM incorporates a stamped metallic freeform mirror or reflector with an off-axis parabolic shape is configured to fold and collimate laser beam. A precision stamping process is deployed to produce an array of miniature, freeform mirrors in high volume applications. The mirror array simplifies the optical path and eliminates passive components such as refractive lenses and dichroic filters that combine RGB beams. Stamped metallic optical components with micro-scale freeform mirrors in the LBM are tolerant of high temperatures and can thermally diffuse heat away from the reflective surface for high power applications.