公开(公告)号：US20070139928A1

公开(公告)日：2007-06-21

申请号：US11484386

申请日：2006-07-11

申请人： Shau Wang ,  Jyh Yu

发明人： Shau Wang ,  Jyh Yu

IPC分类号： F21V23/04

CPC分类号： H05B33/089 ,  H01L25/167 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05B33/0821 ,  H05B33/0854 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED apparatus with temperature self-regulating, over-temperature protection, and over-current protection function comprises an LED chip, a heat dissipation plate, a heat conductive layer and a temperature control device. The heat dissipation and the heat conductive layer disposed thereon carry the LED chip and dissipate the heat generated from the LED chip that is connected to an electric power source for luminance. The temperature control device exhibiting PTC behavior is electrically connected between the LED chip and the electric power source in series, and the distance between the LED chip and the temperature control device is less than 3 cm. The heat conductive layer can consist of polymeric dielectric material and has a heat conduction coefficient larger than 1.0 W/mK at 25° C.

摘要翻译： 具有温度自调节，过温保护和过电流保护功能的LED装置包括LED芯片，散热板，导热层和温度控制装置。 散热部和导热层配置在该LED芯片上，散发从连接于电源的LED芯片产生的热量以发光。 表现为PTC行为的温度控制装置串联地电连接在LED芯片和电源之间，并且LED芯片和温度控制装置之间的距离小于3cm。 导热层可以由聚合物电介质材料组成，并且在25℃下具有大于1.0W / mK的导热系数

公开(公告)号：US20070137835A1

公开(公告)日：2007-06-21

申请号：US11638208

申请日：2006-12-13

申请人： David Chew Wang ,  Jyh Yu

发明人： David Chew Wang ,  Jyh Yu

IPC分类号： F28F7/00 ,  F28F13/18 ,  F28F19/02

CPC分类号： H01L33/642 ,  F28D2021/0029 ,  F28F13/18 ,  H01L24/32 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermal conductive apparatus includes a first electrode sheet, a second electrode sheet, a cooling sheet, and a polymer dielectric layer. The polymer dielectric layer physically contacts the first electrode sheet and the second electrode sheet via the top surface thereof, and the cooling sheet via the bottom surface thereof, and exhibits a coefficient of thermal conductivity above 1.0 W/mK. The interfaces between the first electrode sheet, the second electrode sheet, the cooling sheet, and the polymer dielectric layer include at least one micro-rough surface. The micro-rough surfaces include plural nodules thereon formed by electrodeposition. The first electrode sheet and the second electrode sheet are electrically insulated from each other and are connected to a power source and a heat-generating device to form a conductive circuit loop.

摘要翻译： 导热装置包括第一电极片，第二电极片，冷却片和聚合物电介质层。 聚合物电介质层经由其顶表面物理接触第一电极片和第二电极片，并且经由其底表面与冷却片物理接触，并且表现出高于1.0W / mK的热导率。 第一电极片，第二电极片，冷却片和聚合物电介质层之间的界面包括至少一个微粗糙表面。 微粗糙表面包括通过电沉积形成的多个结节。 第一电极片和第二电极片彼此电绝缘并且连接到电源和发热装置以形成导电电路回路。