公开(公告)号：US20180097531A1

公开(公告)日：2018-04-05

申请号：US15282327

申请日：2016-09-30

Applicant: SILICON LABORATORIES, INC.

Inventor： Ravi K. Kummaraguntla

IPC: H04B1/04

CPC classification number: H04B1/0483 ,  H04B1/0458

Abstract: In one form, a radio frequency (RF) transmitter includes an RF signal source, a balanced/unbalanced transformer (balun), and first and second amplification circuits. The balun has a primary side adapted to be coupled to an antenna, and a secondary side. The first amplification circuit has an input coupled to the RF signal source, and an output coupled to the primary side of the balun. The second amplification circuit has an input coupled to the RF signal source, and an output coupled to the secondary side of the balun. The second amplification circuit has a higher output power than the first amplification circuit.

公开(公告)号：US09806521B2

公开(公告)日：2017-10-31

申请号：US14527205

申请日：2014-10-29

Applicant: Silicon Laboratories Inc.

Inventor： Michael G. Khazhinsky ,  Ravi K. Kummaraguntla

IPC: H02H9/04 ,  H02H3/20 ,  H02H3/02

CPC classification number: H02H9/046 ,  H02H3/02 ,  H02H3/202 ,  H02H9/04

Abstract: A balun includes an input coil and an output coil with first and second outputs that vary during normal operation. The output coil has a center point connection that remains substantially constant during normal operation. An ESD circuit provides a low impedance path between the center point connection and chip ground when the voltage at the center point connection is above a first threshold voltage or below a second threshold voltage and isolates the center point connection from chip ground otherwise. Another ESD protection circuit provides ESD protection for other input or output terminals of the integrated circuit by selectively coupling the other input or output terminals to chip ground. Thus, a charge that builds up between one of the balun outputs and another terminal on the integrated circuit can be safely dissipated.

公开(公告)号：US20160241024A1

公开(公告)日：2016-08-18

申请号：US14625453

申请日：2015-02-18

Applicant: Silicon Laboratories Inc.

Inventor： Timothy J. Dupuis ,  Ravi K. Kummaraguntla

IPC: H02H9/04 ,  H01L23/00 ,  H03H7/42 ,  H01L27/02

CPC classification number: H01L27/0266 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/0255 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1206 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/141 ,  H02H9/046 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A die is mounted in an integrated circuit package. The die includes a balun circuit and an electrostatic discharge (ESD) circuit coupled to a ground of the integrated circuit die. The package has a first output pin coupled to a first terminal of the balun and has a second output pin coupled to a second terminal of the balun through first and second bond wires. The second output pin is connected to board ground. A third bond wire is disposed between the second package terminal and the ESD circuit to provide a safe discharge path through the third bond wire for ESD events affecting the first and second output terminals. Thus, a charge that builds up involving one of the output terminals coupled to the balun can be safely dissipated.

Abstract translation: 芯片安装在集成电路封装中。 芯片包括平衡 - 不平衡转换电路和耦合到集成电路管芯的接地的静电放电（ESD）电路。 封装具有耦合到平衡 - 不平衡变换器的第一端子的第一输出引脚，并具有通过第一和第二接合线耦合到平衡 - 不平衡变换器的第二端子的第二输出引脚。 第二个输出引脚连接到电路板接地。 第三接合线布置在第二封装端子和ESD电路之间，以提供穿过第三接合线的安全放电路径，用于影响第一和第二输出端子的ESD事件。 因此，可以安全地消耗涉及耦合到平衡 - 不平衡转换器的输出端子中的一个的构成的电荷。

公开(公告)号：US20160126725A1

公开(公告)日：2016-05-05

申请号：US14527205

申请日：2014-10-29

Applicant: Silicon Laboratories Inc.

Inventor： Michael G. Khazhinsky ,  Ravi K. Kummaraguntla

IPC: H02H9/04

CPC classification number: H02H9/046 ,  H02H3/02 ,  H02H3/202 ,  H02H9/04

Abstract: A balun includes an input coil and an output coil with first and second outputs that vary during normal operation. The output coil has a center point connection that remains substantially constant during normal operation. An ESD circuit provides a low impedance path between the center point connection and chip ground when the voltage at the center point connection is above a first threshold voltage or below a second threshold voltage and isolates the center point connection from chip ground otherwise. Another ESD protection circuit provides ESD protection for other input or output terminals of the integrated circuit by selectively coupling the other input or output terminals to chip ground. Thus, a charge that builds up between one of the balun outputs and another terminal on the integrated circuit can be safely dissipated.

Abstract translation: 平衡 - 不平衡转换器包括输入线圈和输出线圈，其具有在正常操作期间变化的第一和第二输出。 输出线圈具有在正常操作期间基本保持恒定的中心点连接。 当中心点连接处的电压高于第一阈值电压或低于第二阈值电压时，ESD电路在中心点连接和芯片接地之间提供低阻抗路径，否则将中心点连接与芯片接地隔离。 另一个ESD保护电路通过选择性地将其他输入或输出端子耦合到芯片地来为集成电路的其他输入或输出端子提供ESD保护。 因此，可以安全地耗散在一个平衡 - 不平衡变换器输出和集成电路上的另一个端子之间建立的电荷。

公开(公告)号：US10103759B2

公开(公告)日：2018-10-16

申请号：US15282327

申请日：2016-09-30

Applicant: SILICON LABORATORIES, INC.

Inventor： Ravi K. Kummaraguntla

IPC: H04B1/02 ,  H04B1/04

Abstract: In one form, a radio frequency (RF) transmitter includes an RF signal source, a balanced/unbalanced transformer (balun), and first and second amplification circuits. The balun has a primary side adapted to be coupled to an antenna, and a secondary side. The first amplification circuit has an input coupled to the RF signal source, and an output coupled to the primary side of the balun. The second amplification circuit has an input coupled to the RF signal source, and an output coupled to the secondary side of the balun. The second amplification circuit has a higher output power than the first amplification circuit.

公开(公告)号：US09735145B2

公开(公告)日：2017-08-15

申请号：US14625453

申请日：2015-02-18

Applicant: Silicon Laboratories Inc.

Inventor： Timothy J. Dupuis ,  Ravi K. Kummaraguntla

IPC: H02H9/04 ,  H01L27/02 ,  H01L23/00

CPC classification number: H01L27/0266 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/0255 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1206 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/141 ,  H02H9/046 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A die is mounted in an integrated circuit package. The die includes a balun circuit and an electrostatic discharge (ESD) circuit coupled to a ground of the integrated circuit die. The package has a first output pin coupled to a first terminal of the balun and has a second output pin coupled to a second terminal of the balun through first and second bond wires. The second output pin is connected to board ground. A third bond wire is disposed between the second package terminal and the ESD circuit to provide a safe discharge path through the third bond wire for ESD events affecting the first and second output terminals. Thus, a charge that builds up involving one of the output terminals coupled to the balun can be safely dissipated.