公开(公告)号：US11205644B2

公开(公告)日：2021-12-21

申请号：US16817001

申请日：2020-03-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Rui Wu ,  Fu-Tang Huang ,  Chia-Cheng Chen ,  Chun-Hsien Lin ,  Hsuan-Hao Mi ,  Yu-Cheng Pai

IPC: H01L23/24 ,  H01L25/10 ,  H01L23/498 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

公开(公告)号：US20200328142A1

公开(公告)日：2020-10-15

申请号：US16538286

申请日：2019-08-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Don-Son Jiang ,  Nai-Hao Kao ,  Chih-Sheng Lin ,  Szu-Hsien Chen ,  Chih-Yuan Shih ,  Chia-Cheng Chen ,  Yu-Cheng Pai ,  Hsuan-Hao Mi

IPC: H01L23/498 ,  H01L23/14 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48

Abstract: A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.

公开(公告)号：US20200212019A1

公开(公告)日：2020-07-02

申请号：US16817001

申请日：2020-03-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Rui Wu ,  Fu-Tang Huang ,  Chia-Cheng Chen ,  Chun-Hsien Lin ,  Hsuan-Hao Mi ,  Yu-Cheng Pai

IPC: H01L25/10 ,  H01L23/24 ,  H01L23/498 ,  H01L25/00

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.

公开(公告)号：US20190164941A1

公开(公告)日：2019-05-30

申请号：US15938271

申请日：2018-03-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Rui Wu ,  Fu-Tang Huang ,  Chia-Cheng Chen ,  Chun-Hsien Lin ,  Hsuan-Hao Mi ,  Yu-Cheng Pai

IPC: H01L25/10 ,  H01L23/498 ,  H01L25/00 ,  H01L23/24

Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.