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公开(公告)号：US11205644B2
公开(公告)日：2021-12-21
申请号：US16817001
申请日：2020-03-12
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Rui Wu , Fu-Tang Huang , Chia-Cheng Chen , Chun-Hsien Lin , Hsuan-Hao Mi , Yu-Cheng Pai
Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US20230027120A1
公开(公告)日：2023-01-26
申请号：US17411322
申请日：2021-08-25
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Shao-Tzu Tang , Wen-Jung Tsai , Chih-Hsien Chiu , Ko-Wei Chang , Yu-Wei Yeh , Yu-Cheng Pai , Chuan-Yi Pan , Chi-Rui Wu
IPC: H01Q1/22 , H01L23/552
Abstract: An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
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公开(公告)号：US20200212019A1
公开(公告)日：2020-07-02
申请号：US16817001
申请日：2020-03-12
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Rui Wu , Fu-Tang Huang , Chia-Cheng Chen , Chun-Hsien Lin , Hsuan-Hao Mi , Yu-Cheng Pai
IPC: H01L25/10 , H01L23/24 , H01L23/498 , H01L25/00
Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US20190164941A1
公开(公告)日：2019-05-30
申请号：US15938271
申请日：2018-03-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Rui Wu , Fu-Tang Huang , Chia-Cheng Chen , Chun-Hsien Lin , Hsuan-Hao Mi , Yu-Cheng Pai
IPC: H01L25/10 , H01L23/498 , H01L25/00 , H01L23/24
Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.
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