公开(公告)号：US20210066173A1

公开(公告)日：2021-03-04

申请号：US17096359

申请日：2020-11-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Yi-Hsuan Liu ,  Mei-Chi Chen ,  Ying-Chou Tsai

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

公开(公告)号：US20180061747A1

公开(公告)日：2018-03-01

申请号：US15397927

申请日：2017-01-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Chien-Hui Wang ,  Chung-Yan Huang ,  Ying-Chou Tsai

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/00

CPC classification number: H01L23/49811 ,  G06K9/0002 ,  G06K9/00053 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49805 ,  H01L23/562 ,  H01L23/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.

公开(公告)号：US20180342446A1

公开(公告)日：2018-11-29

申请号：US15720552

申请日：2017-09-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Yi-Hsuan Liu ,  Mei-Chi Chen ,  Ying-Chou Tsai

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

公开(公告)号：US09978673B2

公开(公告)日：2018-05-22

申请号：US15397927

申请日：2017-01-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Chien-Hui Wang ,  Chung-Yan Huang ,  Ying-Chou Tsai

IPC: H01L21/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/00 ,  G06K9/00

CPC classification number: H01L23/49811 ,  G06K9/0002 ,  G06K9/00053 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49805 ,  H01L23/562 ,  H01L23/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.