公开(公告)号：US20180286701A1

公开(公告)日：2018-10-04

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US10903088B2

公开(公告)日：2021-01-26

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552 ,  H01L21/56

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.