公开(公告)号：US10950520B2

公开(公告)日：2021-03-16

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US20180261552A1

公开(公告)日：2018-09-13

申请号：US15975380

申请日：2018-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yue-Ying Jian ,  Wei-Ping Wang ,  Tsung-Ming Li ,  En-Li Lin ,  Kaun-I Cheng ,  Yu-De Chu

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/1421 ,  H01L2924/3025

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

公开(公告)号：US11728178B2

公开(公告)日：2023-08-15

申请号：US17123630

申请日：2020-12-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/552 ,  H01L24/12 ,  H01L27/0623 ,  H01L29/7834 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/81

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US20180286701A1

公开(公告)日：2018-10-04

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US09997469B2

公开(公告)日：2018-06-12

申请号：US15341100

申请日：2016-11-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yue-Ying Jian ,  Wei-Ping Wang ,  Tsung-Ming Li ,  En-Li Lin ,  Kaun-I Cheng ,  Yu-De Chu

IPC: H01L23/31 ,  H01L25/16 ,  H01L25/07 ,  H01L25/11 ,  H01L23/552 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/1421 ,  H01L2924/3025

Abstract: An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

公开(公告)号：US20230343603A1

公开(公告)日：2023-10-26

申请号：US18343544

申请日：2023-06-28

Applicant: Siliconware Precision Industries CO, Ltd

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L24/12 ,  H01L23/485 ,  H01L27/0623 ,  H01L29/7834 ,  H01L23/552 ,  H01L2924/15313 ,  H01L2924/19042 ,  H01L2224/48227 ,  H01L2924/19041 ,  H01L24/48 ,  H01L2224/16227 ,  H01L24/16 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2924/19105 ,  H01L21/561

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US10903088B2

公开(公告)日：2021-01-26

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552 ,  H01L21/56

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US20200168523A1

公开(公告)日：2020-05-28

申请号：US16533716

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kuo-Hua Yu ,  Wen-Shan Tsai ,  En-Li Lin ,  Kaun-I Cheng ,  Wei-Ping Wang

IPC: H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F13/18

Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

公开(公告)号：US12033868B2

公开(公告)日：2024-07-09

申请号：US18343544

申请日：2023-06-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/485 ,  H01L23/552 ,  H01L27/06 ,  H01L29/78

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/552 ,  H01L24/12 ,  H01L27/0623 ,  H01L29/7834 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/81

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US20210143021A1

公开(公告)日：2021-05-13

申请号：US17123630

申请日：2020-12-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.