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公开(公告)号：US11239125B2
公开(公告)日：2022-02-01
申请号：US16232735
申请日：2018-12-26
发明人： Hsien-Lung Hsiao , Yu-Cheng Pai , Chia-Chi Lo , Szu-Hsien Chen , Shu-Chi Chang
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00 , H01L23/60
摘要： A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
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公开(公告)号：US20230343603A1
公开(公告)日：2023-10-26
申请号：US18343544
申请日：2023-06-28
发明人： Shu-Chi Chang , Wei-Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
IPC分类号： H01L21/44 , H01L23/31 , H01L23/00 , H01L23/485 , H01L27/06 , H01L29/78 , H01L23/552
CPC分类号： H01L21/44 , H01L23/3114 , H01L24/12 , H01L23/485 , H01L27/0623 , H01L29/7834 , H01L23/552 , H01L2924/15313 , H01L2924/19042 , H01L2224/48227 , H01L2924/19041 , H01L24/48 , H01L2224/16227 , H01L24/16 , H01L2924/19043 , H01L2924/3025 , H01L2224/97 , H01L2924/19105 , H01L21/561
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US10903088B2
公开(公告)日：2021-01-26
申请号：US15628416
申请日：2017-06-20
发明人： Shu-Chi Chang , Wei Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
IPC分类号： H01L21/44 , H01L23/31 , H01L23/00 , H01L23/485 , H01L27/06 , H01L29/78 , H01L23/552 , H01L21/56
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US12033868B2
公开(公告)日：2024-07-09
申请号：US18343544
申请日：2023-06-28
发明人： Shu-Chi Chang , Wei-Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
IPC分类号： H01L21/44 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/485 , H01L23/552 , H01L27/06 , H01L29/78
CPC分类号： H01L21/44 , H01L23/3114 , H01L23/485 , H01L23/552 , H01L24/12 , H01L27/0623 , H01L29/7834 , H01L21/561 , H01L23/3121 , H01L24/16 , H01L24/48 , H01L2224/16227 , H01L2224/48227 , H01L2224/97 , H01L2924/15313 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/97 , H01L2224/85 , H01L2224/97 , H01L2224/81
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US20210143021A1
公开(公告)日：2021-05-13
申请号：US17123630
申请日：2020-12-16
发明人： Shu-Chi Chang , Wei-Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
IPC分类号： H01L21/44 , H01L23/31 , H01L23/00 , H01L23/485 , H01L27/06 , H01L29/78 , H01L23/552
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US11728178B2
公开(公告)日：2023-08-15
申请号：US17123630
申请日：2020-12-16
发明人： Shu-Chi Chang , Wei-Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
IPC分类号： H01L21/44 , H01L23/31 , H01L23/00 , H01L23/485 , H01L27/06 , H01L29/78 , H01L23/552 , H01L21/56
CPC分类号： H01L21/44 , H01L23/3114 , H01L23/485 , H01L23/552 , H01L24/12 , H01L27/0623 , H01L29/7834 , H01L21/561 , H01L23/3121 , H01L24/16 , H01L24/48 , H01L2224/16227 , H01L2224/48227 , H01L2224/97 , H01L2924/15313 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/97 , H01L2224/85 , H01L2224/97 , H01L2224/81
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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公开(公告)号：US20200035573A1
公开(公告)日：2020-01-30
申请号：US16232735
申请日：2018-12-26
发明人： Hsien-Lung Hsiao , Yu-Cheng Pai , Chia-Chi Lo , Szu-Hsien Chen , Shu-Chi Chang
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00
摘要： A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
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公开(公告)号：US20180286701A1
公开(公告)日：2018-10-04
申请号：US15628416
申请日：2017-06-20
发明人： Shu-Chi Chang , Wei Ping Wang , Hsien-Lung Hsiao , Kaun-I Cheng
摘要： An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
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