公开(公告)号：US11239125B2

公开(公告)日：2022-02-01

申请号：US16232735

申请日：2018-12-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsien-Lung Hsiao ,  Yu-Cheng Pai ,  Chia-Chi Lo ,  Szu-Hsien Chen ,  Shu-Chi Chang

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L23/60

Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.

公开(公告)号：US20230343603A1

公开(公告)日：2023-10-26

申请号：US18343544

申请日：2023-06-28

Applicant: Siliconware Precision Industries CO, Ltd

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L24/12 ,  H01L23/485 ,  H01L27/0623 ,  H01L29/7834 ,  H01L23/552 ,  H01L2924/15313 ,  H01L2924/19042 ,  H01L2224/48227 ,  H01L2924/19041 ,  H01L24/48 ,  H01L2224/16227 ,  H01L24/16 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2924/19105 ,  H01L21/561

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US10903088B2

公开(公告)日：2021-01-26

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552 ,  H01L21/56

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US12033868B2

公开(公告)日：2024-07-09

申请号：US18343544

申请日：2023-06-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/485 ,  H01L23/552 ,  H01L27/06 ,  H01L29/78

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/552 ,  H01L24/12 ,  H01L27/0623 ,  H01L29/7834 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/81

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US20210143021A1

公开(公告)日：2021-05-13

申请号：US17123630

申请日：2020-12-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US11728178B2

公开(公告)日：2023-08-15

申请号：US17123630

申请日：2020-12-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei-Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L21/44 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/552 ,  H01L24/12 ,  H01L27/0623 ,  H01L29/7834 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/81

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

公开(公告)号：US20200035573A1

公开(公告)日：2020-01-30

申请号：US16232735

申请日：2018-12-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsien-Lung Hsiao ,  Yu-Cheng Pai ,  Chia-Chi Lo ,  Szu-Hsien Chen ,  Shu-Chi Chang

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/00

Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.

公开(公告)号：US20180286701A1

公开(公告)日：2018-10-04

申请号：US15628416

申请日：2017-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shu-Chi Chang ,  Wei Ping Wang ,  Hsien-Lung Hsiao ,  Kaun-I Cheng

IPC: H01L21/44 ,  H01L23/31 ,  H01L23/00 ,  H01L23/485 ,  H01L27/06 ,  H01L29/78

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.