Cutting Segment for Cutting Tool and Cutting Tools
    1.
    发明申请
    Cutting Segment for Cutting Tool and Cutting Tools 有权
    切割工具和切割工具切割段

    公开(公告)号:US20080202488A1

    公开(公告)日:2008-08-28

    申请号:US11910611

    申请日:2006-04-19

    IPC分类号: B28D1/04

    摘要: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

    摘要翻译: 本发明提供了一种用于切割或钻削诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。 切割段包括用于切割工件和多个磨料颗粒层的切割表面。 研磨颗粒层垂直于切割方向设置。 每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。 每个磨料列具有排列成一行的多个磨料颗粒。 此外,磨料层之间具有多个坯料部分。 在坯料部分中,磨料颗粒不存在或者相对于磨料行的浓度为70%以下。 另外,空白部分包括相对较厚的空白部分和相对较薄的空白部分。

    Cutting Segment of Cutting Tool and Cutting Tool
    2.
    发明申请
    Cutting Segment of Cutting Tool and Cutting Tool 审中-公开
    切割工具和切割工具的切割部分

    公开(公告)号:US20080219783A1

    公开(公告)日:2008-09-11

    申请号:US11722935

    申请日:2005-12-28

    IPC分类号: B26D1/00 B23D51/10

    摘要: A cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low-concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The cutting segment and the cutting tool are capable of improving cutting rate and useful life.

    摘要翻译: 用于切割或钻孔诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和切割工具。 切割部分包括用于切割工件的切割表面和以多行排列的多个磨料颗粒。 每个磨料列包括高浓度部件和低浓度部件。 将高浓度部件分组在一起,在切割面上形成高浓度区域,将低浓度部分分组在一起,在切割面上形成低浓度区域。 切割段和切割工具能够提高切割速度和使用寿命。

    Cutting segment for cutting tool and cutting tools
    3.
    发明授权
    Cutting segment for cutting tool and cutting tools 有权
    切割工具和切割工具的切割部分

    公开(公告)号:US07954483B2

    公开(公告)日:2011-06-07

    申请号:US11910611

    申请日:2006-04-19

    IPC分类号: B28D1/12

    摘要: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

    摘要翻译: 本发明提供了一种用于切割或钻削诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。 切割段包括用于切割工件和多个磨料颗粒层的切割表面。 研磨颗粒层垂直于切割方向设置。 每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。 每个磨料列具有排列成一行的多个磨料颗粒。 此外,磨料层之间具有多个坯料部分。 在坯料部分中,磨料颗粒不存在或者相对于磨料行的浓度为70%以下。 另外,空白部分包括相对较厚的空白部分和相对较薄的空白部分。

    Cutting segment for diamond tool and diamond tool having the segment
    4.
    发明授权
    Cutting segment for diamond tool and diamond tool having the segment 有权
    金刚石刀具和金刚石刀具的切割部分

    公开(公告)号:US07661419B2

    公开(公告)日:2010-02-16

    申请号:US11911798

    申请日:2006-04-20

    IPC分类号: B28D1/12

    摘要: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

    摘要翻译: 本发明涉及用于切割或钻孔诸如石头,砖,混凝土和沥青的脆性工件的金刚石工具的切割部分和具有该切割部分的金刚石工具。 本发明允许优异的切割速率和长的使用寿命,而不会在切割过程中磨损R。 在切割段中,将多个金刚石颗粒布置在垂直于切割方向堆叠的多个板状层中。 每个金刚石颗粒层在切割表面上具有多个颗粒行。 此外,至少两个金刚石颗粒层在切割方向上从切割区段的前方看到的切割区段的至少一侧重叠。 本发明通过显着减少切割时产生的R磨损,确保均匀切割,从而实现优异的切割速度和更长的使用寿命。

    Cutting Segment For Diamond Tool and Diamond Tool Having the Segment
    5.
    发明申请
    Cutting Segment For Diamond Tool and Diamond Tool Having the Segment 有权
    金刚石工具切割段和分段钻石工具

    公开(公告)号:US20080171505A1

    公开(公告)日:2008-07-17

    申请号:US11911798

    申请日:2006-04-20

    IPC分类号: B24B7/00

    摘要: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

    摘要翻译: 本发明涉及用于切割或钻孔诸如石头,砖,混凝土和沥青的脆性工件的金刚石工具的切割部分和具有该切割部分的金刚石工具。 本发明允许优越的切割速率和长的使用寿命,而不会在切割期间磨损。 在切割段中,将多个金刚石颗粒布置在垂直于切割方向堆叠的多个板状层中。 每个金刚石颗粒层在切割表面上具有多个颗粒行。 此外,至少两个金刚石颗粒层在切割方向上从切割区段的前方看到的切割区段的至少一侧重叠。 本发明通过显着减少切割时产生的R磨损,确保均匀切割,从而实现优异的切割速度和更长的使用寿命。

    Diamond Tool
    6.
    发明申请
    Diamond Tool 有权
    钻石工具

    公开(公告)号:US20080163857A1

    公开(公告)日:2008-07-10

    申请号:US11908067

    申请日:2006-02-13

    IPC分类号: B23D61/02

    摘要: The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.

    摘要翻译: 本发明提供一种段式金刚石工具,其能够通过在金刚石工具的切割部分中适当地布置金刚石颗粒来提高切割速率并减少在切割期间产生的细碎屑的量。 在本发明中,金刚石颗粒层被布置成使得在切割工件时分别通过金刚石颗粒的引导层分别在其上形成有金刚石颗粒的后续层的工件上形成的切割槽布置在其上形成的切割槽之间。 切割段具有高浓度和低浓度区域。 高浓度区域的浓度高于平均浓度,低浓度区域的浓度低于平均浓度。 此外,在切割段的前部和/或后部形成至少一个低浓度区域。 本发明的金刚石工具确保了切割时产生的优异的切割速度和减少的细碎屑的量。

    Diamond tool
    7.
    发明授权
    Diamond tool 有权
    钻石工具

    公开(公告)号:US08028687B2

    公开(公告)日:2011-10-04

    申请号:US11908067

    申请日:2006-02-13

    IPC分类号: B28D1/12

    摘要: The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.

    摘要翻译: 本发明提供一种段式金刚石工具,其能够通过在金刚石工具的切割部分中适当地布置金刚石颗粒来提高切割速率并减少在切割期间产生的细碎屑的量。 在本发明中,金刚石颗粒层被布置成使得在切割工件时分别通过金刚石颗粒的引导层分别在其上形成有金刚石颗粒的后续层的工件上形成的切割槽布置在其上形成的切割槽之间。 切割段具有高浓度和低浓度区域。 高浓度区域的浓度高于平均浓度,低浓度区域的浓度低于平均浓度。 此外,在切割段的前部和/或后部形成至少一个低浓度区域。 本发明的金刚石工具确保了切割时产生的优异的切割速度和减少的细碎屑的量。

    Cutting tip for diamond tool and diamond tool
    8.
    发明授权
    Cutting tip for diamond tool and diamond tool 有权
    金刚石工具和金刚石工具的刀尖

    公开(公告)号:US07337775B2

    公开(公告)日:2008-03-04

    申请号:US10503799

    申请日:2003-02-07

    IPC分类号: B28D1/12

    摘要: A cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. A cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.

    摘要翻译: 用于金刚石工具的切割尖端和具有该切割尖端的金刚石工具,其用于切割或穿孔各种脆性材料,例如石头,砖,混凝土和沥青。 特别地,用于金刚石工具和金刚石工具的切割尖端具有适当排列以提高切割速率的金刚石颗粒。 一种用于金刚石工具的切割尖端,其具有分布在切割尖端中的金刚石颗粒,其中金刚石颗粒在平行于切割表面的平面中相对于切割方向倾斜,并且排列成使得沟槽通道相继重叠在 切削作业中的脆性物质。

    Cutting tip for diamond tool and diamond tool
    9.
    发明申请
    Cutting tip for diamond tool and diamond tool 有权
    金刚石工具和金刚石工具的刀尖

    公开(公告)号:US20050103534A1

    公开(公告)日:2005-05-19

    申请号:US10503799

    申请日:2003-02-07

    摘要: The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present invention provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.

    摘要翻译: 本发明涉及一种用于金刚石工具的切割尖端和具有该切割尖端的金刚石工具,其用于切割或穿孔各种脆性材料,例如石头,砖,混凝土和沥青。 特别地,用于金刚石工具和金刚石工具的切割尖端具有适当排列以提高切割速率的金刚石颗粒。 本发明提供了一种用于金刚石工具的切割尖端,其具有分布在切割尖端中的金刚石颗粒,其中金刚石颗粒在平行于切割表面的平面中相对于切割方向倾斜,并且排列成形成沟槽通道 在切割操作中依次重叠在脆性物质上。

    Cutting tip of frame saw and frame saw with the cutting tip
    10.
    发明授权
    Cutting tip of frame saw and frame saw with the cutting tip 有权
    切割尖端的框架锯和框架锯的切割尖端

    公开(公告)号:US08656901B2

    公开(公告)日:2014-02-25

    申请号:US12281004

    申请日:2007-02-28

    IPC分类号: B28D1/12

    CPC分类号: B28D1/127 B24D99/005

    摘要: A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.

    摘要翻译: 公开了一种用于切割或钻出诸如石头,砖,混凝土或沥青的脆性工件的切割工具的切割尖端和设置有切割尖端的框架锯。 包括磨料颗粒的摆动式切割尖端具有能够提高磨料颗粒的切割效率的特定布置,从而实现切割性能的提高和寿命的增加。 切割尖端包括多个磨料颗粒以在摆动时切割工件。 研磨颗粒的至少一部分以研磨颗粒组的形式排列。 每个研磨颗粒组由至少两个研磨颗粒构成。 研磨颗粒组的研磨颗粒的至少一部分在切割方向上重叠。