摘要:
The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
摘要:
The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.
摘要:
The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
摘要:
A cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low-concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The cutting segment and the cutting tool are capable of improving cutting rate and useful life.
摘要:
A cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. A cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
摘要:
The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
摘要:
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
摘要:
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
摘要:
The present invention relates to a cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. The present invention provides a cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
摘要:
A transmission apparatus and method for serial and parallel channel interworking in an optical transport network are provided. The transmission apparatus for serial and parallel channel interworking ensures interworking between parallel optical modules or between parallel and serial optical modules, regardless of a protocol, without having to add logics or with only a minimum number of logics, in order to manufacture a small-size optical module with low power consumption.