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公开(公告)号:US20200381831A1
公开(公告)日:2020-12-03
申请号:US16892282
申请日:2020-06-03
Applicant: Space Exploration Technologies Corp.
Inventor: David Milroy , Samuel Belden
Abstract: In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.
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公开(公告)号:US20230142216A1
公开(公告)日:2023-05-11
申请号:US17983233
申请日:2022-11-08
Applicant: Space Exploration Technologies Corp.
Inventor: Darya Malkova , David Milroy , Samuel Belden
Abstract: In one example of the present disclosure, a radome assembly for use with an antenna assembly is described. The radome assembly may comprise a radome body portion having a first side and a second side, wherein the radome body portion defines a portion of a housing for an antenna assembly. The radome assembly may further comprise an outer layer coupled to the first side of the radome body portion, wherein the outer layer is made from a different material than the radome body portion, and wherein at least a portion of the outer layer is exposed to an outdoor environment and has hydrophobic properties
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公开(公告)号:US11652286B2
公开(公告)日:2023-05-16
申请号:US16892282
申请日:2020-06-03
Applicant: Space Exploration Technologies Corp.
Inventor: David Milroy , Samuel Belden
IPC: H01Q1/02 , H01Q1/42 , H01Q9/04 , H01Q1/12 , H01Q1/22 , H01Q1/38 , H01Q23/00 , H01Q15/14 , H01Q21/06 , H01Q21/10 , H01Q21/00
CPC classification number: H01Q1/428 , H01Q1/02 , H01Q1/1207 , H01Q1/1228 , H01Q1/2283 , H01Q1/38 , H01Q1/42 , H01Q1/422 , H01Q9/0407 , H01Q9/0414 , H01Q15/144 , H01Q21/00 , H01Q21/065 , H01Q21/10 , H01Q23/00 , H01Q1/2291
Abstract: In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.
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