High-power ion sputtering magnetron
    1.
    发明申请
    High-power ion sputtering magnetron 审中-公开
    大功率离子溅射磁控管

    公开(公告)号:US20030173217A1

    公开(公告)日:2003-09-18

    申请号:US10098559

    申请日:2002-03-14

    CPC classification number: H01J37/3411 H01J37/3405 H01J37/3497

    Abstract: A high-power ion sputtering magnetron having a rotary cathode comprising a conducting member disposed within the rotary cathode being made of an electrically conductive material for conducting electrical current from the power supply to the rotary cathode. The ion sputtering magnetron also has an electromagnetic field shield disposed between the conducting member and the drive shaft portion. The field shield is made of an electromagnetic field-permeable material such as a ferrous material for reducing damage to parts adjacent to the rotary cathode that are susceptible to inductive magnetic heating.

    Abstract translation: 具有旋转阴极的高功率离子溅射磁控管,其包括设置在旋转阴极内的导电构件,其由用于将电流从电源传导到旋转阴极的导电材料制成。 离子溅射磁控管还具有设置在导电构件和驱动轴部分之间的电磁场屏蔽。 场屏蔽由诸如铁类材料的电磁场可渗透材料制成,用于减少对感应磁加热敏感的与旋转阴极相邻的部分的损伤。

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