公开(公告)号：US12266621B2

公开(公告)日：2025-04-01

申请号：US17622229

申请日：2021-12-16

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jinming Shi ,  Huiru Zhao

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/16

Abstract: A display panel, a method of manufacturing the display panel, and a display device are provided. According to the display panel provided by the embodiment of the present application, a bonding structure is arranged between a display substrate and a circuit board to connect the display substrate and the circuit board together, and a width of the bonding structure is set to be 50 microns (μm)-200 μm, so that when a plurality of display panels are spliced to realize a large-screen display, a width of an interval area between the adjacent display areas of the display panels may be significantly reduced.

公开(公告)号：US20240038697A1

公开(公告)日：2024-02-01

申请号：US17622229

申请日：2021-12-16

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Jinming Shi ,  Huiru Zhao

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/05 ,  H01L25/167 ,  H01L24/08 ,  H01L24/80 ,  H01L24/03 ,  H01L2224/0345 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/0518 ,  H01L2224/08225 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/80203 ,  H01L2224/80805

Abstract: A display panel, a method of manufacturing the display panel, and a display device are provided. According to the display panel provided by the embodiment of the present application, a bonding structure is arranged between a display substrate and a circuit board to connect the display substrate and the circuit board together, and a width of the bonding structure is set to be 50 microns (μm)-200 μm, so that when a plurality of display panels are spliced to realize a large-screen display, a width of an interval area between the adjacent display areas of the display panels may be significantly reduced.