DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240192567A1

    公开(公告)日:2024-06-13

    申请号:US17785436

    申请日:2022-06-07

    CPC classification number: G02F1/1685 G02F1/1677

    Abstract: The present invention provides a display panel and a manufacturing method of the display panel. In the present invention, an adjustment structure is arranged on the light-emitting layer, and black photosensitive particles are arranged in the adjustment structure. When the display panel is in a bright state, light emitted by the light-emitting unit illuminates the black photosensitive particles, and the black photosensitive particles move toward positions corresponding to first gaps. Therefore, brightness at the light-emitting units is increased, and brightness at the first gaps is decreased. Accordingly, a contrast ratio of the display panel is increased.

    DISPLAY PANEL
    2.
    发明申请

    公开(公告)号:US20250133834A1

    公开(公告)日:2025-04-24

    申请号:US19007870

    申请日:2025-01-02

    Abstract: A display panel is provided, including a grounding signal wiring, driving chips, a driving chip input output signal wiring, and a power line. A grounding signal pin is connected to the grounding signal wiring. The driving chip input output signal wiring is configured to connect a stage-transfer signal input pin and a stage-transfer signal output pin of two adjacent driving chips. The grounding signal wiring, the driving chip input output signal wiring, and the power line are disposed in a same layer and do not intersect with each other.

    BACKLIGHT MODULES AND DISPLAY DEVICES
    3.
    发明公开

    公开(公告)号:US20240241406A1

    公开(公告)日:2024-07-18

    申请号:US18622893

    申请日:2024-03-30

    Abstract: Disclosed are a backlight module and a display device. The backlight module includes: a driving backplate; and an optical film disposed on a side of the driving backplate light taking-off. The driving backplate includes a substrate, a plurality of electronic elements and an adhesive layer. The plurality of electronic elements are disposed on a side of the substrate close to the optical film, and the adhesive layer is disposed on the plurality of electronic elements. The adhesive layer includes a plurality of first adhesive-dispensed portions arranged at intervals, the plurality of first adhesive-dispensed portions contact and support the optical film. At least one edge of a support region formed by every four adjacent ones of the plurality of first adhesive-dispensed portions is at an angle with a row direction or a column direction of the plurality of electronic elements.

    DRIVING BACKPLATES, MANUFACTURING METHODS THEREOF, AND DISPLAY DEVICES

    公开(公告)号:US20240264487A1

    公开(公告)日:2024-08-08

    申请号:US18202934

    申请日:2023-05-28

    Inventor: Hongzhao DENG

    CPC classification number: G02F1/133605 G02F1/133603 G02F1/134336

    Abstract: The present disclosure discloses a driving backplate, a manufacturing method thereof, and a display device. The driving backplate includes a substrate, a reflective layer disposed on a side of a substrate, and a plurality of electronic devices disposed on a side of the reflective layer away from the substrate; the reflective layer includes a plurality of openings, and includes a plurality of overlapping parts disposed adjacent to the openings and corresponding to the plurality of openings; and an orthogonal projection of each of the overlapping parts on a plane of the substrate overlaps with an orthogonal projection of a part of each of the electronic devices on the plane of the substrate.

    BACKLIGHT MODULES AND DISPLAY DEVICES
    5.
    发明公开

    公开(公告)号:US20240222581A1

    公开(公告)日:2024-07-04

    申请号:US18307610

    申请日:2023-04-26

    CPC classification number: H01L33/62 G02B6/0073

    Abstract: A backlight module includes a light source module, a binding terminal unit, a plurality of first signal wires disposed in a same layer and spaced apart, and a plurality of signal connection wires. The plurality of first signal wires are disposed to correspond to a plurality of binding terminal parts of the binding terminal unit one-to-one. Each of the first signal wires is configured to connect a first binding terminal of one of the binding terminal parts with one light source unit of the light source module. In adjacent two of binding terminal parts, one of the first signal wires corresponding to one of adjacent two of the binding terminal parts is connected to one of the first signal wires corresponding to another one of the adjacent two of the binding terminal parts through one of the signal connection wires.

    LIGHT-EMITTING BOARD AND PREPARATION METHOD THEREOF

    公开(公告)号:US20240154071A1

    公开(公告)日:2024-05-09

    申请号:US18067992

    申请日:2022-12-19

    CPC classification number: H01L33/46 H01L25/167 H01L2933/0025

    Abstract: Provided is a light-emitting panel comprising a substrate, a plurality of light-emitting device, and a reflection sheet, wherein the plurality of light-emitting devices and the reflection sheet are disposed on the same side of the substrate, the reflection sheet comprises a plurality of first through-holes, which are in one-to-one correspondence with the plurality of light-emitting devices, and the reflection sheet at an edge of the plurality of first through-holes is configured to wrap around an edge of the plurality of light-emitting device, and a gap between an edge of the plurality of first through-holes and an edge adjacent to the plurality of light-emitting devices is less than 0.1 mm, so that a distance between the edge of the plurality of first through holes and the edge of the plurality of light-emitting devices is reduced, and the size and width of the windowed area are reduced.

    DISPLAY PANEL
    7.
    发明公开
    DISPLAY PANEL 审中-公开

    公开(公告)号:US20240055418A1

    公开(公告)日:2024-02-15

    申请号:US17765588

    申请日:2022-03-30

    CPC classification number: H01L25/167 H01L27/124

    Abstract: A display panel is provided, including a power line, light-emitting lamp groups, partition channel wirings, driving chips, and a grounding signal wiring. The driving chips, the light-emitting lamp groups, and the partition channel wirings are disposed between the power line and the grouping signal wiring spaced apart. The driving chips are connected to the grounding signal wiring. The light-emitting lamp groups are connected to the power line. The partition channel wirings are connected to the light-emitting lamp groups. The power line, the grounding signal wiring, and the partition channel wirings are disposed in a same layer.

    LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE

    公开(公告)号:US20250113688A1

    公开(公告)日:2025-04-03

    申请号:US17799658

    申请日:2022-07-25

    Abstract: The present application provides a light-emitting substrate and a display device, the light-emitting substrate includes a substrate, multiple signal lines, and multiple light-emitting units. The signal lines at least include a first signal line and a second signal line. The first signal line is provided with a signal access terminal and a first connection terminal. The second signal line is provided with a second connection terminal. The first connection terminal is electrically connected to the second connection terminal, and the signal access terminal receives signals.

    DRIVING BACKPLATES, MANUFACTURING METHODS THEREOF, AND DISPLAY DEVICES

    公开(公告)号:US20240393640A1

    公开(公告)日:2024-11-28

    申请号:US18790926

    申请日:2024-07-31

    Inventor: Hongzhao DENG

    Abstract: The present disclosure discloses a driving backplate, a manufacturing method thereof, and a display device. The driving backplate includes a substrate, a reflective layer disposed on a side of a substrate, and a plurality of electronic devices disposed on a side of the reflective layer away from the substrate; the reflective layer includes a plurality of openings, and includes a plurality of overlapping parts disposed adjacent to the openings and corresponding to the plurality of openings; and an orthogonal projection of each of the overlapping parts on a plane of the substrate overlaps with an orthogonal projection of a part of each of the electronic devices on the plane of the substrate.

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